Pattern recovery by dry etching of gap-induced blurring in nanostencil lithography
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This paper describes F-based dry etching and resulting surface properties of biocompatible silicone elastomer. The etch rate of polysiloxane and surface morphology was found to be highly temperature dependent. An increase in temperature results in a signif ...
We present the fabrication of 150 nm half-pitch Si grating templates by reactive ion etch (RIE), which are used in nanoimprint lithography (NIL) for high groove density gratings in SU-8 plastic. The etch properties such as the etch rate, profile and etchin ...
Abstract: A simple and fast process to fabricate micro-electro-mechanical (MEM) resonators with deep sub-micron transduction gaps in thin SOI is presented. The proposed process is realized on both 350 nm and 1.5 μm thin silicon-on-insulator (SOI) substrate ...
A technique to deterministically manipulate individual Carbon Nanotubes (CNT) has been the brick-wall for the boom of CNT based devices. Here we demonstrate dielectrophoresis as an efficient technique to trap individual Single Walled Carbon Nanotubes (SWCN ...
Stencil lithography is a surface patterning technique that relies on the local physical vapor deposition of material through miniaturized shadow mask membranes. It is extremely useful for the formation of patterns, mainly thin structured metal films, in si ...
We report on the fabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity in which electrodes are used to ignite a low power (≪500 mW ...
Gold nanoparticles with hydrophobic surface have been deposited on a silicon substrate chemically patterned by reactive ion etching through a stencil mask and chemical vapour deposition of alkyl silanes. After deposition by dipping and adequate rinsing, th ...
We present nanostencil lithography as a new and parallel nanopatterning technique for batch fabrication of micro/ nanoelectromechanical systems (MEMS/NEMS) with high throughput and resolution. We use nanostencil lithography for the purpose of integrating n ...
Modern communication devices demand challenging specifications in terms of miniaturization, performance, power consumption and cost. Every new generation of radio frequency integrated circuits (RF-ICs) offer better functionality at reduced size, power cons ...
We report on the fabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity in which electrodes are used to ignite a low power (≪500 mW ...