DUV/MEMS based stencils for full-wafer scale, resistless, patterning of mesoscopic structures
Graph Chatbot
Chat with Graph Search
Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.
DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.
Sub-micron scale lithography methods using deep UV, X-ray or electron beams will allow for further progress in integrated circuit hardware manufacturing. The drawback of these high-end patterning methods however is firstly, the high cost of the equipment, ...
We compare three different approaches to high-resolution contact lithography with special emphasis on contrast mechanisms for subwavelength structures. Masks with protruding metal absorbers, masks with absorbers embedded in the transparent background, and ...
We present an optical investigation of GaN pillars using both micro-Raman (mu-Raman) and microphotoluminescence (mu-PL) spectroscopy. GaN pillars of diameter ranging from 100 nm to 5 mum were fabricated by electron beam lithography and reactive ion etching ...
This paper describes a method of thin film and MEMS processing which uses self-assembled monolayers as ultra-thin organic surface coating to enable a simple removal of microfabricated devices off the surface without wet chemical etching. A 1.5-nm thick sel ...
Ferroelectric thin films for memory and MEMS applications require noble metal or refractory metal oxide electrodes. In this paper, physical and chemical parameters during etching of RuO2 and Pr by a dual frequency ECR/RF reactor have been investigated. The ...
Ferroelectric thin films for memory and MEMS applications require noble metal or refractory metal oxide electrodes. In this paper, physical and chemical mechanisms during platinum etching by a dual frequency ECR/RF reactor have been investigated. An ion be ...
We discuss the potential and limitations of Light-coupling masks for high-resolution subwavelength optical lithography. Using a three-dimensional fully vectorial numerical approach based on Green's tensor technique, the near-field distribution of the elect ...
This paper describes single and two layer processes to realize thick resist moulds (40 and 80 μm) with a good reproducibility. The patterning of a thick AZ 4562 photoresist layer is performed with standard photolithography equipment. Different problems rel ...
