Physical design (electronics)In integrated circuit design, physical design is a step in the standard design cycle which follows after the circuit design. At this step, circuit representations of the components (devices and interconnects) of the design are converted into geometric representations of shapes which, when manufactured in the corresponding layers of materials, will ensure the required functioning of the components. This geometric representation is called integrated circuit layout.
NanowireA nanowire is a nanostructure in the form of a wire with the diameter of the order of a nanometre (10−9 metres). More generally, nanowires can be defined as structures that have a thickness or diameter constrained to tens of nanometers or less and an unconstrained length. At these scales, quantum mechanical effects are important—which coined the term "quantum wires". Many different types of nanowires exist, including superconducting (e.g. YBCO), metallic (e.g. Ni, Pt, Au, Ag), semiconducting (e.g.
NanostructureA nanostructure is a structure of intermediate size between microscopic and molecular structures. Nanostructural detail is microstructure at nanoscale. In describing nanostructures, it is necessary to differentiate between the number of dimensions in the volume of an object which are on the nanoscale. Nanotextured surfaces have one dimension on the nanoscale, i.e., only the thickness of the surface of an object is between 0.1 and 100 nm. Nanotubes have two dimensions on the nanoscale, i.e.
Multi-project wafer serviceMulti-project chip (MPC), and multi-project wafer (MPW) semiconductor manufacturing arrangements allow customers to share mask and microelectronics wafer fabrication cost between several designs or projects. With the MPC arrangement, one chip is a combination of several designs and this combined chip is then repeated all over the wafer during the manufacturing. MPC arrangement produces typically roughly equal number of chip designs per wafer.
Signoff (electronic design automation)In the automated design of integrated circuits, signoff (also written as sign-off) checks is the collective name given to a series of verification steps that the design must pass before it can be taped out. This implies an iterative process involving incremental fixes across the board using one or more check types, and then retesting the design. There are two types of sign-off's: front-end sign-off and back-end sign-off. After back-end sign-off, the chip goes to fabrication.
Die shrinkThe term die shrink (sometimes optical shrink or process shrink) refers to the scaling of metal–oxide–semiconductor (MOS) devices. The act of shrinking a die creates a somewhat identical circuit using a more advanced fabrication process, usually involving an advance of lithographic nodes. This reduces overall costs for a chip company, as the absence of major architectural changes to the processor lowers research and development costs while at the same time allowing more processor dies to be manufactured on the same piece of silicon wafer, resulting in less cost per product sold.
Integrated circuit designIntegrated circuit design, or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography. IC design can be divided into the broad categories of digital and analog IC design. Digital IC design is to produce components such as microprocessors, FPGAs, memories (RAM, ROM, and flash) and digital ASICs.
Output deviceAn output device is a piece of computer hardware that converts information into a human-perceptible form or, historically, into a physical machine-readable form for use with other non-computerized equipment. It can be text, graphics, tactile, audio, or video. Examples include monitors, printers, speakers, headphones, projectors, GPS devices, optical mark readers, and braille readers.
Global illuminationGlobal illumination (GI), or indirect illumination, is a group of algorithms used in 3D computer graphics that are meant to add more realistic lighting to 3D scenes. Such algorithms take into account not only the light that comes directly from a light source (direct illumination), but also subsequent cases in which light rays from the same source are reflected by other surfaces in the scene, whether reflective or not (indirect illumination).
Human interface deviceA human interface device or HID is a type of computer device usually used by humans that takes input from humans and gives output to humans. The term "HID" most commonly refers to the USB HID specification. The term was coined by Mike Van Flandern of Microsoft when he proposed that the USB committee create a Human Input Device class working group. The working group was renamed as the Human Interface Device class at the suggestion of Tom Schmidt of DEC because the proposed standard supported bi-directional communication.
