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Machine learning and data processing algorithms have been thriving in finding ways of processing and classifying information by exploiting the hidden trends of large datasets. Although these emerging computational methods have become successful in today's ...
This thesis presents an efficient and extensible numerical software framework for real-time model-based control. We are motivated by complex and challenging mechatronic applications spanning from flight control of fixed-wing aircraft and thrust vector cont ...
Technology scaling has progressed to enable integrated circuits with extremely high density enabling systems of tremendous complexity with manageable power consumption. With the continuation of Moore's law for many years, electronic chips have been able to ...
Nowadays electric power systems are subject to continuous changes and the needs in the power generation and delivery service are constantly increasing, with a higher complexity of a progressively more distributed network. Because the impact of a failure ca ...
The information revolution of the last decade has been fueled by the digitization of almost all human activities through a wide range of Internet services. The backbone of this information age are scale-out datacenters that need to collect, store, and proc ...
Integration of silicon nanowires (Si NWs) in three-dimensional (3D) devices including integrated circuits (ICs) and microelectromechanical systems (MEMS) leads to enhanced functionality and performance in diverse applications. The immediate challenge to th ...
How about fastening a knot? not with ropes... but with timber panels. Timber Fabric
Structures (TFS) originate from such an inspiration. An architectural reinterpretation
of fabric techniques (mainly braiding) using building scale timber panels to design ...
With FPGAs facing broader application domains, the conversion of imperative languages into dataflow circuits has been recently revamped as a way to overcome the conservatism of statically scheduled high-level synthesis. Apart from the ability to extract pa ...
Three-dimensional (3D) stacking of integrated-circuit (IC) dies increases system density and package functionality by vertically integrating two or more dies with area-array through-silicon-vias (TSVs). This reduces the length of global interconnects and t ...
Substantial downscaling of the feature size in current CMOS technology has confronted digital designers with serious challenges including short channel effect and high amount of leakage power. To address these problems, emerging nano-devices, e.g., Silicon ...