Publication

3D structuration of LTCC / thick-film sensors and fluidic devices

Abstract

Thick-film and LTCC (Low Temperature Cofired Ceramic) technologies are now recognised as valid platforms for the fabrication of novel devices at the mesoscale for sensor, actuator, fluidic, electrical and packaging applications. In these fields, they allow the fabrication of sensitive, yet robust and cost effective devices. This work reviews and comments the different available structuration techniques, with an emphasis on sensor technology and on structuration methods based on sacrificial layers. This is exemplified through various sensors and related devices developed at our laboratory and elsewhere. Processing conditions are also discussed, with the aim of obtaining useful and reproducible sacrificial materials. Key words: sensors, thick-film, LTCC, 3D structuration, sacrificial layers, processing.

About this result
This page is automatically generated and may contain information that is not correct, complete, up-to-date, or relevant to your search query. The same applies to every other page on this website. Please make sure to verify the information with EPFL's official sources.

Graph Chatbot

Chat with Graph Search

Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.

DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.