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Generic technological platform for microfabricationg silicon nitride micro-and nanopipette arrays

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Generic technological platform for microfabricationg silicon nitride micro-and nanopipette arrays

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Microfabrication d'objets composites fonctionnels en 3D et à haut facteur de forme, par procédés UV-LIGA et microstéréolithographie

Silicon sacrificial layer dry etching (SSLDE) for free-standing RF MEMS architectures

90 MHz nanomechanical structures fabricated by stencil deposition and dry etching

90 MHz nanomechanical structures fabricated by stencil deposition and dry etching

Size effect in mesoscopic epitaxial ferroelectric structures: Increase of piezoelectric response with decreasing feature size

Size-effect in mesoscopic epitaxial ferroelectric structures: Increase of piezoelectric response with decreasing feature-size

Polymer microfluidic chips for electrochemical and biochemical analyses

Manufacture of micro-electro-mechanical-system using sacrificial layer made of silicon, useful for micro-electro-mechanical-system device architecture, e.g. radio-frequency capacitive switch and current switch

Low numerical aperture refractive microlenses in fused silica

DEEP ANISOTROPIC ETCHING OF SILICON USING LOW PRESSURE HIGH DENSITY PLASMA. PRESENTATION OF COMPLEMENTARY TECHNIQUES AND THEIR APPLICATIONS IN MICROTECHNOLOGY.

Microfabrication d'objets composites fonctionnels en 3D et à haut facteur de forme, par procédés UV-LIGA et microstéréolithographie

Silicon sacrificial layer dry etching (SSLDE) for free-standing RF MEMS architectures

Manufacture of micro-electro-mechanical-system using sacrificial layer made of silicon, useful for micro-electro-mechanical-system device architecture, e.g. radio-frequency capacitive switch and current switch

Polymer microfluidic chips for electrochemical and biochemical analyses

Size effect in mesoscopic epitaxial ferroelectric structures: Increase of piezoelectric response with decreasing feature size

90 MHz nanomechanical structures fabricated by stencil deposition and dry etching

Size-effect in mesoscopic epitaxial ferroelectric structures: Increase of piezoelectric response with decreasing feature-size

90 MHz nanomechanical structures fabricated by stencil deposition and dry etching

Low numerical aperture refractive microlenses in fused silica

DEEP ANISOTROPIC ETCHING OF SILICON USING LOW PRESSURE HIGH DENSITY PLASMA. PRESENTATION OF COMPLEMENTARY TECHNIQUES AND THEIR APPLICATIONS IN MICROTECHNOLOGY.