Complete Nanowire Crossbar Framework Optimized for the Multi-Spacer Patterning Technique
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Semiconductor device research for digital circuit design is currently facing increasing challenges to enhance miniaturization and performance. A huge economic push and the interest in novel applications are stimulating the development of new pathways to ov ...
The key factor in widespread adoption of Radio Frequency Identification (RFID) technology is tag cost minimization. This paper presents the first low-cost, ultra-low power, passive RFID tag, fully integrated on a single substrate in a standard CMOS process ...
Institute of Electrical and Electronics Engineers2014
This study adds a new dimension to lab-on-a-chip systems by employing three-dimensional (3D) integration technology for improved performance, higher functionality, and on-chip computational power. Despite the extensive amount of current research on 3D memo ...
Logic circuits and the ability to amplify electrical signals form the functional backbone of electronics along with the possibility to integrate multiple elements on the same chip. The miniaturization of electronic circuits is expected to reach fundamental ...
The challenge of wafer-scale integration of silicon nanowires into microsystems is addressed by developing a fabrication approach that utilizes a combination of Bosch-process-based nanowire fabrication with surface micromachining and chemical-mechanical-po ...
Aggressive scaling of the supply voltage reduces the energy needed for switching of standard CMOS devices. However, advanced CMOS technologies are facing two main problems that consequently lead to higher power consumption: the complexity of a further supp ...
With technology scaling reaching the fundamental limits of Si-CMOS in the near future, the semiconductor industry is in quest for innovation from various disciplines of integrated circuit (IC) design. At a fundamental level, technology forms the main drive ...
The main aim of this thesis is to examine the advantages of 3D stacking applied to microprocessors and related integrated microprocessor systems in the architectural level. In the succession of years microprocessors are aiming towards lower power consumpti ...
The emerging three-dimensional (3D) integration technology is expected to lead to an industry paradigm shift due to its tremendous benefits. Intense research activities are going on about technology, simulation, design, and product prototypes. This thesis ...
The strong interaction between Electronic Design Automation (EDA) tools and Complementary Metal-Oxide Semiconductor (CMOS) technology contributed substantially to the advancement of modern digital electronics. The continuous downscaling of CMOS Field Effec ...