Package on a packagePackage on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of slightly higher height requirements. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations.
Advanced Audio CodingAdvanced Audio Coding (AAC) is an audio coding standard for lossy digital audio compression. Designed to be the successor of the MP3 format, AAC generally achieves higher sound quality than MP3 encoders at the same bit rate. AAC has been standardized by ISO and IEC as part of the MPEG-2 and MPEG-4 specifications. Part of AAC, HE-AAC ("AAC+"), is part of MPEG-4 Audio and is adopted into digital radio standards DAB+ and Digital Radio Mondiale, and mobile television standards DVB-H and ATSC-M/H.
MPEG-1MPEG-1 is a standard for lossy compression of video and audio. It is designed to compress VHS-quality raw digital video and CD audio down to about 1.5 Mbit/s (26:1 and 6:1 compression ratios respectively) without excessive quality loss, making video CDs, digital cable/satellite TV and digital audio broadcasting (DAB) practical. Today, MPEG-1 has become the most widely compatible lossy audio/video format in the world, and is used in a large number of products and technologies.
WinampWinamp is a media player for Microsoft Windows originally developed by Justin Frankel and Dmitry Boldyrev by their company Nullsoft, which they later sold to AOL in 1999 for $80 million. It was then acquired by Radionomy in 2014. Since version 2 it has been sold as freemium and supports extensibility with plug-ins and skins, and features music visualization, playlist and a media library, supported by a large online community. Version 1 of Winamp was released in 1997, and quickly grew popular with over 3 million downloads, paralleling the developing trend of MP3 (music) .
Integrated circuit packagingIn electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
Optical filterAn optical filter is a device that selectively transmits light of different wavelengths, usually implemented as a glass plane or plastic device in the optical path, which are either dyed in the bulk or have interference coatings. The optical properties of filters are completely described by their frequency response, which specifies how the magnitude and phase of each frequency component of an incoming signal is modified by the filter. Filters mostly belong to one of two categories.
Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
PCI ExpressPCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe or PCI-e, is a high-speed serial computer expansion bus standard, designed to replace the older PCI, PCI-X and AGP bus standards. It is the common motherboard interface for personal computers' graphics cards, sound cards, hard disk drive host adapters, SSDs, Wi-Fi and Ethernet hardware connections.
Package testingPackage testing or packaging testing involves the measurement of a characteristic or property involved with packaging. This includes packaging materials, packaging components, primary packages, shipping containers, and unit loads, as well as the associated processes. Testing measures the effects and interactions of the levels of packaging, the package contents, external forces, and end-use. It can involve controlled laboratory experiments, subjective evaluations by people, or field testing.
Optical coatingAn optical coating is one or more thin layers of material deposited on an optical component such as a lens, prism or mirror, which alters the way in which the optic reflects and transmits light. These coatings have become a key technology in the field of optics. One type of optical coating is an anti-reflective coating, which reduces unwanted reflections from surfaces, and is commonly used on spectacle and camera lenses. Another type is the high-reflector coating, which can be used to produce mirrors that reflect greater than 99.
