Semiconductor deviceA semiconductor device is an electronic component that relies on the electronic properties of a semiconductor material (primarily silicon, germanium, and gallium arsenide, as well as organic semiconductors) for its function. Its conductivity lies between conductors and insulators. Semiconductor devices have replaced vacuum tubes in most applications. They conduct electric current in the solid state, rather than as free electrons across a vacuum (typically liberated by thermionic emission) or as free electrons and ions through an ionized gas.
Wafer (electronics)In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning.
Wafer-level packagingWafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached.
Aluminium foilAluminium foil (or aluminum foil in North American English; often informally called tin foil) is aluminium prepared in thin metal leaves. The foil is pliable, and can be readily bent or wrapped around objects. Thin foils are fragile and are sometimes laminated with other materials such as plastics or paper to make them stronger and more useful. Annual production of aluminium foil was approximately in Europe and in the U.S. in 2003. Approximately 75% of aluminium foil is used for packaging of foods, cosmetics, and chemical products, and 25% is used for industrial applications (e.
Induction sealingInduction sealing is the process of bonding thermoplastic materials by induction heating. This involves controlled heating an electrically conducting object (usually aluminum foil) by electromagnetic induction, through heat generated in the object by eddy currents. Induction sealing is used in many types of manufacturing. In packaging it is used for package fabrication such as forming tubes from flexible materials, attaching plastic closures to package forms, etc.
Integrated circuit packagingIn electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
Crystalline siliconCrystalline silicon or (c-Si) Is the crystalline forms of silicon, either polycrystalline silicon (poly-Si, consisting of small crystals), or monocrystalline silicon (mono-Si, a continuous crystal). Crystalline silicon is the dominant semiconducting material used in photovoltaic technology for the production of solar cells. These cells are assembled into solar panels as part of a photovoltaic system to generate solar power from sunlight. In electronics, crystalline silicon is typically the monocrystalline form of silicon, and is used for producing microchips.
Integrated passive devicesIntegrated passive devices (IPDs), also known as integrated passive components (IPCs) or embedded passive components (EPC), are electronic components where resistors (R), capacitors (C), inductors (L)/coils/chokes, microstriplines, impedance matching elements, baluns or any combinations of them are integrated in the same package or on the same substrate. Sometimes integrated passives can also be called as embedded passives, and still the difference between integrated and embedded passives is technically unclear.
Speech processingSpeech processing is the study of speech signals and the processing methods of signals. The signals are usually processed in a digital representation, so speech processing can be regarded as a special case of digital signal processing, applied to speech signals. Aspects of speech processing includes the acquisition, manipulation, storage, transfer and output of speech signals. Different speech processing tasks include speech recognition, speech synthesis, speaker diarization, speech enhancement, speaker recognition, etc.
High dynamic rangeHigh dynamic range (HDR) is a dynamic range higher than usual, synonyms are wide dynamic range, extended dynamic range, expanded dynamic range. The term is often used in discussing the dynamic range of various signals such as s, videos, audio or radio. It may apply to the means of recording, processing, and reproducing such signals including analog and digitized signals. The term is also the name of some of the technologies or techniques allowing to achieve high dynamic range images, videos, or audio.
