Publications related to SOI digital pixel sensor based on charge pumping

Evaluation of HPK n plus -p planar pixel sensors for the CMS Phase-2 upgrade

Varun Sharma, Konstantin Androsov, Xin Chen, Rakesh Chawla, Werner Lustermann, Andromachi Tsirou, Alexis Kalogeropoulos, Andrea Rizzi, Thomas Muller, David Vannerom, Albert Perez, Alessandro Caratelli, François Robert, Davide Ceresa, Yong Yang, Ajay Kumar, Ashish Sharma, Georgios Anagnostou, Kai Yi, Jing Li, Stefano Michelis, David Parker, Martin Fuchs

To cope with the challenging environment of the planned high luminosity upgrade of the Large Hadron Collider (HL-LHC), scheduled to start operation in 2029, CMS will replace its entire tracking system. The requirements for the tracker are largely determine ...

Amsterdam2023

MALTA-Cz: a radiation hard full-size monolithic CMOS sensor with small electrodes on high-resistivity Czochralski substrate

Edoardo Charbon, Francesco Piro, Ashish Sharma

Depleted Monolithic Active Pixel Sensor (DMAPS) sensors developed in the Tower Semiconductor 180 nm CMOS imaging process have been designed in the context of the ATLAS ITk upgrade Phase-II at the HL-LHC and for future collider experiments. The "MALTA-Czoch ...

Bristol2023

A 500 x 500 Dual-Gate SPAD Imager With 100% Temporal Aperture and 1 ns Minimum Gate Length for FLIM and Phasor Imaging Applications

Edoardo Charbon, Claudio Bruschini, Andrei Ardelean, Paul Mos, Arin Can Ülkü, Michael Alan Wayne

In this article, we report on SwissSPAD3 (SS3), a 500 x 500 pixel single-photon avalanche diode (SPAD) array, fabricated in 0.18-mu m CMOS technology. In this sensor, we introduce a novel dual-gate architecture with two contiguous temporal windows, or gate ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2022

reference data for "A Critical Comparison of Annual Glare Simulation Methods"

Jan Wienold, Stephen William Wasilewski

Scene and reference results files for: "A Critical Comparison of Annual Glare Simulation Methods" Stephen Wasilewski, Jan Wienold, Marilyne Andersen 2022 Buildsim Nordic, Copenhagen Contents: 01-06*.tar.gz: reference simulation image archives, one ...

Zenodo2022

A Pixel Design of a Branching Ultra-Highspeed Image Sensor

Edoardo Charbon

A burst image sensor named Hanabi, meaning fireworks in Japanese, includes a branching CCD and multiple CMOS readout circuits. The sensor is backside-illuminated with a light/charge guide pipe to minimize the temporal resolution by suppressing the horizont ...

2021

Beyond Cameras: Real-Time High-Resolution 3D and Panoramic MultiView Vision Systems with Their Applications

Bilal Demir

The cameras are invented by imitating the human visual system to capture the scene. The camera technologies have been substantially advanced in recent years. 108 MP resolution with 100x hybrid zoom has become standard features for smartphone flagships. In ...

EPFL2020

Simulation of CMOS APS Operation and Crosstalk in SPICE With Generalized Devices

Jean-Michel Sallese, Chiara Rossi

We present SPICE simulations of a CMOS APS pixel element consisting of the optical sensor with the sensing circuit. The photodiode is simulated at the physics level by means of the so-called Generalized Devices, without any predefined compact model. Conver ...

2020

Hessian Splines For Scanning Transmission X-Ray Microscopy

Michaël Unser, Thomas Jean Debarre

Scanning transmission X-ray microscopy (STXM) produces images in which each pixel value is related to the measured attenuation of an X-ray beam. In practice, the location of the illuminated region does not exactly match the desired uniform pixel grid. This ...

IEEE2020

Full SPICE Simulation of a CMOS Active Pixel Sensor with Generalized Devices

Jean-Michel Sallese, Chiara Rossi

We present SPICE simulations of a CMOS APS pixel element consisting of the optical sensor and the circuit. The photodiode is simulated at the physics level by means of the so-called generalized devices, without any predefined compact model. Conversely, reg ...

IEEE2019

A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology

Edoardo Charbon, Myung Jae Lee, Preethi Padmanabhan, Augusto Ronchini Ximenes

This article introduces a modular, direct time-of-flight (TOF) depth sensor. Each module is digitally synthesized and features a 2

\times

(8

\times

8) single-photon avalanche diode (SPAD) pixel array, an edge-sensitive decision tree, a shared time-to ...

2019

SOI digital pixel sensor based on charge pumping

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Evaluation of HPK n plus -p planar pixel sensors for the CMS Phase-2 upgrade

MALTA-Cz: a radiation hard full-size monolithic CMOS sensor with small electrodes on high-resistivity Czochralski substrate

A 500 x 500 Dual-Gate SPAD Imager With 100% Temporal Aperture and 1 ns Minimum Gate Length for FLIM and Phasor Imaging Applications

reference data for "A Critical Comparison of Annual Glare Simulation Methods"

A Pixel Design of a Branching Ultra-Highspeed Image Sensor

Beyond Cameras: Real-Time High-Resolution 3D and Panoramic MultiView Vision Systems with Their Applications

Simulation of CMOS APS Operation and Crosstalk in SPICE With Generalized Devices

Hessian Splines For Scanning Transmission X-Ray Microscopy

Full SPICE Simulation of a CMOS Active Pixel Sensor with Generalized Devices

A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology

MALTA-Cz: a radiation hard full-size monolithic CMOS sensor with small electrodes on high-resistivity Czochralski substrate

A Pixel Design of a Branching Ultra-Highspeed Image Sensor

A 500 x 500 Dual-Gate SPAD Imager With 100% Temporal Aperture and 1 ns Minimum Gate Length for FLIM and Phasor Imaging Applications

reference data for "A Critical Comparison of Annual Glare Simulation Methods"

Beyond Cameras: Real-Time High-Resolution 3D and Panoramic MultiView Vision Systems with Their Applications

Hessian Splines For Scanning Transmission X-Ray Microscopy

Simulation of CMOS APS Operation and Crosstalk in SPICE With Generalized Devices

A Modular, Direct Time-of-Flight Depth Sensor in 45/65-nm 3-D-Stacked CMOS Technology

Evaluation of HPK n plus -p planar pixel sensors for the CMS Phase-2 upgrade

Full SPICE Simulation of a CMOS Active Pixel Sensor with Generalized Devices