Interfacial intermetallic growth and strength of composite lead-free solder alloy through isothermal aging
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Aluminum zinc alloys constitute an important class of wrought alloys, the so-called 7000 series, and are also widely used as anti-corrosion coatings of steel sheets. They are also interesting from a more fundamental point of view because zinc, a hexagonal ...
In this study, a deep analysis of the reliability of lead-free (SnAgCu) solders in comparison with tin-lead solders have been done for a particular aerospace application. Creep properties of this solder composition have been investigated, and results have ...
Int Assoc Engineers-Iaeng, Unit1, 1-F, 37-39 Hung To Road, Kwun Tong, Hong Kong, 00000, Peoples R China2008
Abstract: Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to s ...
Mechanisms responsible for the embrittlement of leaded "free-machining" copper alloys at intermediate temperatures (i.e. around 400 °C) are examined using a combination of microstructural and mechanical characterization. Tensile tests are conducted on pure ...
Three different approaches for metal to ceramic brazing are compared using the example of Si3N4/TiN-steel joints: the use of an active filler metal (single layer brazing system), the metallisation of the ceramic and brazing with a non active filler (two-la ...
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Nowadays the joining of dissimilar materials is often the only solution to fulfill the complex requirements of high technology applications. One of the fields in which the research activity is more intense and promising is that of the brazing of ceramics w ...
Packaging is the last step of the manufacturing process of Microsystems. The LPM is working on the development of a two-part soldered packaging. One part of the package is metallic; the other part is made of glass. The goal of the project is to solder the ...
Packaging is the last process of microsystem manufacturing. There are mainly two kinds of packages: plastic or metallic. The two main components of the package (base and cover) may either be glued or soldered. Each of these techniques has its advantages an ...
An overview is presented of current research at EPFL on structural metallic materials produced by infiltration processing. The paper comprises a brief introduction to the infiltration process, then presents results on particle reinforced metals and open-ce ...
