Interfacial intermetallic growth and strength of composite lead-free solder alloy through isothermal aging
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A systematic study of the solidification mechanisms of binary Sn-Cu and ternary Sn-Cu-Ni alloys has been carried out. It is found that Sn-Cu is a weakly-irregular eutectic system with Cu6Sn5 as the leading phase. Interestingly, two different eutectic morph ...
Copper-based composites reinforced with alumina particles are produced by two different pro- cesses, namely gas pressure driven infiltration of a porous alumina preform and a two-step in-situ process developed in the course of this work. The resulting comp ...
Solders are widely used as interconnect material for the electronic industry. The solder interconnect provides both electrical contact and mechanical connection between the integrated circuit devices and their substrate. Thus solders with good reliability ...
Five ternary Sn-0.7Cu-xNi alloys with nickel contents in the range 0-1000 ppm have been directionally solidified at different growth rates. The competition between primary tetragonal Sn cells/dendrites, eutectic and primary Cu6Sn5 is interpreted with phase ...
Copper and copper alloys typically experience a sharp loss in ductility at intermediate temperature, induced by grain boundary damage and fracture processes. The susceptibility of the material to intermediate temperature embrittlement is, as a result, stro ...
We show that steel-magnesium alloy laminated metal composites (LMCs) can be produced by gas pressure infiltration of a liquid magnesium alloy between layers of stacked dimpled steel sheets. Resulting LMCs are amenable to subsequent warm rolling. The LMCs a ...
In jewelry manufacturing, joining dissimilar materials is usually achieved by brazing or soldering, in which the materials comprising the joint are heated to a suitable temperature in the presence of a filler metal having a liquidus below the solidus of th ...
The current study proposes a combined experimental and modeling approach to characterize the mechanical response of composite lead-free solders. The influence of the reinforcement volume fraction on the shear response of the solder material in the joint is ...
Capillary fluidic self-assembly (SA) intrinsically features massively-parallel, contactless die handling and allows for high-precision die placement. It may thus boost die-to-substrate assembly throughput and scalability. Here we characterize for the first ...
Residual stress relief in ceramic-metal joints produced by active brazing depends primarily on the plastic response of the filler metal. A procedure for the production and mechanical characterization of bulk active filler alloy specimens is developed. In p ...