SensorA sensor is a device that produces an output signal for the purpose of sensing a physical phenomenon. In the broadest definition, a sensor is a device, module, machine, or subsystem that detects events or changes in its environment and sends the information to other electronics, frequently a computer processor. Sensors are used in everyday objects such as touch-sensitive elevator buttons (tactile sensor) and lamps which dim or brighten by touching the base, and in innumerable applications of which most people are never aware.
Automotive electronicsAutomotive electronics are electronic systems used in vehicles, including engine management, ignition, radio, carputers, telematics, in-car entertainment systems, and others. Ignition, engine and transmission electronics are also found in trucks, motorcycles, off-road vehicles, and other internal combustion powered machinery such as forklifts, tractors and excavators. Related elements for control of relevant electrical systems are also found on hybrid vehicles and electric cars.
Proximity fuzeA proximity fuze (or fuse) is a fuze that detonates an explosive device automatically when it approaches within a certain distance of its target. Proximity fuzes are designed for elusive military targets such as airplanes and missiles, as well as ships at sea and ground forces. This sophisticated trigger mechanism may increase lethality by 5 to 10 times compared to the common contact fuze or timed fuze. Before the invention of the proximity fuze, detonation was induced by direct contact, a timer set at launch, or an altimeter.
Co-fired ceramicCo-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for robust assembly and packaging of electronic components multi-layer packaging in the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.
Hybrid vehicle drivetrainHybrid vehicle drivetrains transmit power to the driving wheels for hybrid vehicles. A hybrid vehicle has multiple forms of motive power. Hybrids come in many configurations. For example, a hybrid may receive its energy by burning gasoline, but switch between an electric motor and a combustion engine. Electrical vehicles have a long history combining internal combustion and electrical transmission - as in a diesel–electric power-train - although they have mostly been used for rail locomotives.
Sensor nodeA sensor node (also known as a mote in North America), consists of an individual node from a sensor network that is capable of performing a desired action such as gathering, processing or communicating information with other connected nodes in a network. Although wireless sensor networks have existed for decades and used for diverse applications such as earthquake measurements or warfare, the modern development of small sensor nodes dates back to the 1998 Smartdust project and the NASA.
BiCMOSBipolar CMOS (BiCMOS) is a semiconductor technology that integrates two semiconductor technologies, those of the bipolar junction transistor and the CMOS (complementary metal–oxide–semiconductor) logic gate, into a single integrated circuit. In more recent times the bipolar processes have been extended to include high mobility devices using silicon–germanium junctions.
Fused filament fabricationFused filament fabrication (FFF), also known as fused deposition modeling (with the trademarked acronym FDM), or filament freeform fabrication, is a 3D printing process that uses a continuous filament of a thermoplastic material. Filament is fed from a large spool through a moving, heated printer extruder head, and is deposited on the growing work. The print head is moved under computer control to define the printed shape.
Wafer-level packagingWafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached.
Target marketA target market, also known as serviceable obtainable market (SOM), is a group of customers within a business's serviceable available market at which a business aims its marketing efforts and resources. A target market is a subset of the total market for a product or service. The target market typically consists of consumers who exhibit similar characteristics (such as age, location, income or lifestyle) and are considered most likely to buy a business's market offerings or are likely to be the most profitable segments for the business to service by OCHOM Once the target market(s) have been identified, the business will normally tailor the marketing mix (4 Ps) with the needs and expectations of the target in mind.
