Capteurvignette|Le système informatique d'un avion de ligne gère en une fraction de seconde les données issues de nombreux capteurs (vitesse, direction, contrôle des réacteurs). vignette|Capteur infrarouge. Un capteur est un dispositif transformant l'état d'une grandeur physique observée en une grandeur utilisable, telle qu'une tension électrique, une hauteur de mercure, un courant électrique ou la déviation d'une aiguille. Le capteur se distingue de l'instrument de mesure par le fait qu'il ne s'agit que d'une interface entre un processus physique et une information manipulable.
Automotive electronicsAutomotive electronics are electronic systems used in vehicles, including engine management, ignition, radio, carputers, telematics, in-car entertainment systems, and others. Ignition, engine and transmission electronics are also found in trucks, motorcycles, off-road vehicles, and other internal combustion powered machinery such as forklifts, tractors and excavators. Related elements for control of relevant electrical systems are also found on hybrid vehicles and electric cars.
Fusée de proximitéthumb|Fusée de proximité Mark 53 telle qu'utilisée par l’United States Navy. Photo prise dans les années 1950. Une fusée de proximité, conçue à l'origine pour l'artillerie antiaérienne, sert à déclencher la détonation d'un explosif quand la distance entre la fusée et la cible est plus petite qu'une certaine valeur ou quand la fusée atteint une certaine altitude en tombant. Cette fusée d'artillerie serait l'une des plus importantes innovations techniques militaires apparues lors de la Seconde Guerre mondiale.
Co-fired ceramicCo-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for robust assembly and packaging of electronic components multi-layer packaging in the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.
Hybrid vehicle drivetrainHybrid vehicle drivetrains transmit power to the driving wheels for hybrid vehicles. A hybrid vehicle has multiple forms of motive power. Hybrids come in many configurations. For example, a hybrid may receive its energy by burning gasoline, but switch between an electric motor and a combustion engine. Electrical vehicles have a long history combining internal combustion and electrical transmission - as in a diesel–electric power-train - although they have mostly been used for rail locomotives.
Sensor nodeA sensor node (also known as a mote in North America), consists of an individual node from a sensor network that is capable of performing a desired action such as gathering, processing or communicating information with other connected nodes in a network. Although wireless sensor networks have existed for decades and used for diverse applications such as earthquake measurements or warfare, the modern development of small sensor nodes dates back to the 1998 Smartdust project and the NASA.
BiCMOSBiCMOS (contraction de Bipolar-CMOS) est le nom d'une technique de circuit intégré alliant les avantages du CMOS et du bipolaire en un seul circuit intégré. Plus récemment, les processus bipolaires ont été étendus pour inclure des dispositifs à haute mobilité utilisant des jonctions silicium-germanium. Les transistors bipolaires offrent une grande vitesse, un gain élevé et une faible impédance de sortie avec une consommation d'énergie relativement élevée par composant.
Dépôt de fil fonduLe dépôt de fil fondu (DFF) ou Fused deposition modeling (FDM) ou encore Fused Filament Fabrication (FFF) est une technologie d'impression 3D. On appelle aussi ce procédé impression 3D par extrusion de matériau Material Extrusion 3D printing (MEX). Cette technologie consiste à déposer de la matière à l'état liquide couche par couche. La technologie utilise le plus souvent un filament de matière polymère qui est fondu puis extrudé pour construire une pièce couche par couche.
Wafer-level packagingWafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached.
Cible (marketing)A target market, also known as serviceable obtainable market (SOM), is a group of customers within a business's serviceable available market at which a business aims its marketing efforts and resources. A target market is a subset of the total market for a product or service. The target market typically consists of consumers who exhibit similar characteristics (such as age, location, income or lifestyle) and are considered most likely to buy a business's market offerings or are likely to be the most profitable segments for the business to service by OCHOM Once the target market(s) have been identified, the business will normally tailor the marketing mix (4 Ps) with the needs and expectations of the target in mind.
