Self-Aligned 3D Chip Integration Technology and Through-Silicon Serial Data Transmission
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We review the most important fabrication techniques for glass and plastic refractive microlenses and we quantitatively characterize in a systematic way the corresponding state-of-the-art microlenses, which we obtained from selected research groups. For all ...
This paper presents the experimental characterization of two-terminal microfabricated capacitors for microarrays with an electrical sensing of label-free deoxyribonucleic acid (DNA). So far, such a concept has been demonstrated only in experimental setups ...
We present a novel optical sensor concept that merges integrated optics and micro-mechanics in a monolithic substrate. This concept pushes microsystems integration and defines a new class of monolithic optical microsystems where only optical signals are pr ...
Current Systems-On-Chip (SoC) execute applications that demand extensive parallel processing. Networks-On-Chip (NoC) provide a structured way of realizing interconnections on silicon, and obviate the limitations of bus-based solution. NoCs can have regular ...
We address the design of complex monolithic systems, where processing cores generate and consume a varying and large amount of data, thus bringing the communication links to the edge of congestion. Typical applications are in the area of multi-media proces ...
We demonstrate a simple angle-multiplexing holographic storage system, using a single acousto-optic deflector to achieve fast random access to the stored holograms. We used this system to store as many as 300 holograms in a 90 degrees-geometry Fe:LiNbO3 cr ...
Since the emergence of Silicon On Insulator (SOI) technology the research activities have been concentrated on a detailed analysis of SOI devices and their use in different application fields (low-voltage, low-power circuits, high temperature electronics, ...
This paper presents fabrication and RF characterization results of spiral inductors fabricated using a developed damascene-like thick-copper / polyimide process module. This module has low thermal budget and is compatible with current IC interconnect archi ...