Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
Spacecraft propulsionSpacecraft propulsion is any method used to accelerate spacecraft and artificial satellites. In-space propulsion exclusively deals with propulsion systems used in the vacuum of space and should not be confused with space launch or atmospheric entry. Several methods of pragmatic spacecraft propulsion have been developed, each having its own drawbacks and advantages. Most satellites have simple reliable chemical thrusters (often monopropellant rockets) or resistojet rockets for orbital station-keeping and some use momentum wheels for attitude control.
Spacecraft electric propulsionSpacecraft electric propulsion (or just electric propulsion) is a type of spacecraft propulsion technique that uses electrostatic or electromagnetic fields to accelerate mass to high speed and thus generate thrust to modify the velocity of a spacecraft in orbit. The propulsion system is controlled by power electronics. Electric thrusters typically use much less propellant than chemical rockets because they have a higher exhaust speed (operate at a higher specific impulse) than chemical rockets.
Laser propulsionLaser propulsion is a form of beam-powered propulsion where the energy source is a remote (usually ground-based) laser system and separate from the reaction mass. This form of propulsion differs from a conventional chemical rocket where both energy and reaction mass come from the solid or liquid propellants carried on board the vehicle. The basic concepts underlying a photon-propelled "sail" propulsion system were developed by Eugene Sanger and the Hungarian physicist György Marx.
Beam-powered propulsionBeam-powered propulsion, also known as directed energy propulsion, is a class of aircraft or spacecraft propulsion that uses energy beamed to the spacecraft from a remote power plant to provide energy. The beam is typically either a microwave or a laser beam and it is either pulsed or continuous. A continuous beam lends itself to thermal rockets, photonic thrusters and light sails, whereas a pulsed beam lends itself to ablative thrusters and pulse detonation engines.
PropulsionPropulsion is the generation of force by any combination of pushing or pulling to modify the translational motion of an object, which is typically a rigid body (or an articulated rigid body) but may also concern a fluid. The term is derived from two Latin words: pro, meaning before or forward; and pellere, meaning to drive. A propulsion system consists of a source of mechanical power, and a propulsor (means of converting this power into propulsive force).
Wafer-level packagingWafer-level packaging (WLP) is a process where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WSP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached.
Very Large Scale IntegrationVery large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit (Metal Oxide Semiconductor) chips were developed and then widely adopted, enabling complex semiconductor and telecommunication technologies. The microprocessor and memory chips are VLSI devices. Before the introduction of VLSI technology, most ICs had a limited set of functions they could perform.
SpacecraftA spacecraft (: spacecraft) is a vehicle that is designed to fly in outer space and operate there. Spacecraft are used for a variety of purposes, including communications, Earth observation, meteorology, navigation, space colonization, planetary exploration, and transportation of humans and cargo. All spacecraft except single-stage-to-orbit vehicles cannot get into space on their own, and require a launch vehicle (carrier rocket).
