Modeling techniques and verification methodologies for substrate coupling effects in mixed-signal system-on-chip designs
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SPAD (single-photon avalanche diode) arrays are single-photon imagers that can provide unparalleled timeresolved sensing performance. Since their inception in standard CMOS technologies (2003), a host of architectures and target applications have been expl ...
This study adds a new dimension to lab-on-a-chip systems by employing three-dimensional (3D) integration technology for improved performance, higher functionality, and on-chip computational power. Despite the extensive amount of current research on 3D memo ...
Substantial downscaling of the feature size in current CMOS technology has confronted digital designers with serious challenges including short channel effect and high amount of leakage power. To address these problems, emerging nano-devices, e.g., Silicon ...
The information revolution of the last decade has been fueled by the digitization of almost all human activities through a wide range of Internet services. The backbone of this information age are scale-out datacenters that need to collect, store, and proc ...
The main aim of this thesis is to examine the advantages of 3D stacking applied to microprocessors and related integrated microprocessor systems in the architectural level. In the succession of years microprocessors are aiming towards lower power consumpti ...
Embedded memory remains a major bottleneck in current integrated circuit design in terms of silicon area, power dissipation, and performance; however, static random access memories (SRAMs) are almost exclusively supplied by a small number of vendors throug ...
An efficient communications apparatus is described for a vector signaling code to transport data and optionally a clocking signal between integrated circuit devices. Methods of designing such apparatus and their associated codes based on a new metric herei ...
An X-band core chip is designed and fabricated in 0.18-um CMOS technology, which can significantly reduce the monolithic microwave integrated circuit count required for realizing an active beam-former T/R module. The core chip consists of two RX/TX paths, ...
Institute of Electrical and Electronics Engineers2012
The advent of 3-D fabrication technology makes it possible to stack a large amount of last-level cache memory onto a multi-core die to reduce off-chip memory accesses and, thus, increases system performance. However, the higher power density (i.e., power d ...
Modern society is dependent on reliable electricity for security, health, communication, transportation, finance, computers and nearly all aspects of the contemporary life. Providing reliable electricity is a very complex challenge. It involves real-time m ...