Publication

Surface-Tension-Driven Multi-Chip Self-Alignment Techniques for Heterogeneous 3D Integration

About
Privacy
Disclaimer

Graph Chatbot

Chat with Graph Search

Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.

DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.

Surface-Tension-Driven Multi-Chip Self-Alignment Techniques for Heterogeneous 3D Integration

Graph Chatbot

Chat with Graph Search

The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias

Integrated multiplexed microwave readout of silicon quantum dots in a cryogenic CMOS chip

Femtosecond laser-based optomechanical processes for permanent and high-precision fine alignment of optical systems

Towards Deeply Scaled 3D MPSoCs with Integrated Flow Cell Array Technology

Copper TSV-Based Process Development for Die-Level Homogeneous and Heterogeneous 3D Integration Platform

A Chip-Level Post-CMOS Via-Last Cu TSV Process for Multi-Layer Homogeneous 3D Integration

Impact of Data Serialization over TSVs on Routing Congestion in 3D-Stacked Multi-Core Processors

Cost-Effective Design of Mesh-of-Tree Interconnect for Multi-Core Clusters with 3-D Stacked L2 Scratchpad Memory

Flip-chip integration of Si bare dies on polymeric substrates at low temperature using ICA vias made in dry film photoresist

A Die-Level Post-CMOS Processing Protocol for Multi-Layer 3D Integration