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Towards Multi-Fabric 3D Integration Architectures

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Towards Multi-Fabric 3D Integration Architectures

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Design and fabrication of the thruster heads for the MicroThrust MEMS electrospray propulsion system

A 3.1mW 8b 1.2GS/s Single-Channel Asynchronous SAR ADC with Alternate Comparators for Enhanced Speed in 32nm Digital SOI CMOS

Design iterations on Lego R - like MEMS bricks

Design Methods and Tools for Application-Specific Predictable Networks-on-Chip

3D Integration Technology for Lab-on-a-Chip Applications

Closing the Gap between FPGA and ASIC

A Distributed Interleaving Scheme for Efficient Access to WideIO DRAM Memory

3D-LIN: A Configurable Low-Latency Interconnect for Multi-Core Clusters with 3D Stacked L1 Memory

Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology

Making Wide-Issue VLIW Processors Viable on FPGAs