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Two-Phase Flow Boiling in a Single Layer of Future High-Performance 3D Stacked Computer Chips
Related concepts (33)
Boiling
Boiling is the rapid phase transition from liquid to gas or vapor; the reverse of boiling is condensation. Boiling occurs when a liquid is heated to its boiling point, so that the vapour pressure of the liquid is equal to the pressure exerted on the liquid by the surrounding atmosphere. Boiling and evaporation are the two main forms of liquid vapourization. There are two main types of boiling: nucleate boiling where small bubbles of vapour form at discrete points, and critical heat flux boiling where the boiling surface is heated above a certain critical temperature and a film of vapour forms on the surface.
Three-dimensional integrated circuit
A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Integrated circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
Evaporative cooler
An evaporative cooler (also known as evaporative air conditioner, swamp cooler, swamp box, desert cooler and wet air cooler) is a device that cools air through the evaporation of water. Evaporative cooling differs from other air conditioning systems, which use vapor-compression or absorption refrigeration cycles. Evaporative cooling exploits the fact that water will absorb a relatively large amount of heat in order to evaporate (that is, it has a large enthalpy of vaporization).
Working fluid
For fluid power, a working fluid is a gas or liquid that primarily transfers force, motion, or mechanical energy. In hydraulics, water or hydraulic fluid transfers force between hydraulic components such as hydraulic pumps, hydraulic cylinders, and hydraulic motors that are assembled into hydraulic machinery, hydraulic drive systems, etc. In pneumatics, the working fluid is air or another gas which transfers force between pneumatic components such as compressors, vacuum pumps, pneumatic cylinders, and pneumatic motors.
System on a chip
A system on a chip or system-on-chip (SoC ,ˈɛsoʊsiː; pl. SoCs ,ˈɛsoʊsiːz) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices, input/output interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip.
Flash evaporation
Flash evaporation (or partial evaporation) is the partial vapor that occurs when a saturated liquid stream undergoes a reduction in pressure by passing through a throttling valve or other throttling device. This process is one of the simplest unit operations. If the throttling valve or device is located at the entry into a pressure vessel so that the flash evaporation occurs within the vessel, then the vessel is often referred to as a flash drum.
Working fluid selection
Heat engines, refrigeration cycles and heat pumps usually involve a fluid to and from which heat is transferred while undergoing a thermodynamic cycle. This fluid is called the working fluid. Refrigeration and heat pump technologies often refer to working fluids as refrigerants. Most thermodynamic cycles make use of the latent heat (advantages of phase change) of the working fluid. In case of other cycles the working fluid remains in gaseous phase while undergoing all the processes of the cycle.
Multi-chip module
A multi-chip module (MCM) is generically an electronic assembly (such as a package with a number of conductor terminals or "pins") where multiple integrated circuits (ICs or "chips"), semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit".
Boiling point
The boiling point of a substance is the temperature at which the vapor pressure of a liquid equals the pressure surrounding the liquid and the liquid changes into a vapor. The boiling point of a liquid varies depending upon the surrounding environmental pressure. A liquid in a partial vacuum, i.e., under a lower pressure, has a lower boiling point than when that liquid is at atmospheric pressure. Because of this, water boils at under standard pressure at sea level, but at at altitude.