MOS Technology 6502The MOS Technology 6502 (typically pronounced "sixty-five-oh-two" or "six-five-oh-two") is an 8-bit microprocessor that was designed by a small team led by Chuck Peddle for MOS Technology. The design team had formerly worked at Motorola on the Motorola 6800 project; the 6502 is essentially a simplified, less expensive and faster version of that design. When it was introduced in 1975, the 6502 was the least expensive microprocessor on the market by a considerable margin.
Graphics processing unitA graphics processing unit (GPU) is a specialized electronic circuit initially designed to accelerate computer graphics and (either on a video card or embedded on the motherboards, mobile phones, personal computers, workstations, and game consoles). After their initial design, GPUs were found to be useful for non-graphic calculations involving embarrassingly parallel problems due to their parallel structure. Other non-graphical uses include the training of neural networks and cryptocurrency mining.
Package on a packagePackage on a package (PoP) is an integrated circuit packaging method to vertically combine discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed atop each other, i.e. stacked, with a standard interface to route signals between them. This allows higher component density in devices, such as mobile phones, personal digital assistants (PDA), and digital cameras, at the cost of slightly higher height requirements. Stacks with more than 2 packages are uncommon, due to heat dissipation considerations.
Processor designProcessor design is a subfield of computer science and computer engineering (fabrication) that deals with creating a processor, a key component of computer hardware. The design process involves choosing an instruction set and a certain execution paradigm (e.g. VLIW or RISC) and results in a microarchitecture, which might be described in e.g. VHDL or Verilog. For microprocessor design, this description is then manufactured employing some of the various semiconductor device fabrication processes, resulting in a die which is bonded onto a chip carrier.
Network on a chipA network on a chip or network-on-chip (NoC ˌɛnˌoʊˈsiː or nɒk ) is a network-based communications subsystem on an integrated circuit ("microchip"), most typically between modules in a system on a chip (SoC). The modules on the IC are typically semiconductor IP cores schematizing various functions of the computer system, and are designed to be modular in the sense of network science. The network on chip is a router-based packet switching network between SoC modules.
Intel 8086The 8086 (also called iAPX 86) is a 16-bit microprocessor chip designed by Intel between early 1976 and June 8, 1978, when it was released. The Intel 8088, released July 1, 1979, is a slightly modified chip with an external 8-bit data bus (allowing the use of cheaper and fewer supporting ICs), and is notable as the processor used in the original IBM PC design. The 8086 gave rise to the x86 architecture, which eventually became Intel's most successful line of processors.
PhotomaskA photomask is an opaque plate with transparent areas that allow light to shine through in a defined pattern. Photomasks are commonly used in photolithography for the production of integrated circuits (ICs or "chips") to produce a pattern on a thin wafer of material (usually silicon). Several masks are used in turn, each one reproducing a layer of the completed design, and together known as a mask set. For IC production in the 1960s and early 1970s, an opaque rubylith film laminated onto a transparent mylar sheet was used.
MEMSMEMS (Microelectromechanical systems) is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size (i.e., 0.001 to 0.1 mm), and MEMS devices generally range in size from 20 micrometres to a millimetre (i.e., 0.02 to 1.0 mm), although components arranged in arrays (e.g., digital micromirror devices) can be more than 1000 mm2.
Pin grid arrayA pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package. PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket. PGAs allow for more pins per integrated circuit than older packages, such as dual in-line package (DIP).
Floorplan (microelectronics)In electronic design automation, a floorplan of an integrated circuit is a schematic representation of tentative placement of its major functional blocks. In modern electronic design process floorplans are created during the floorplanning design stage, an early stage in the hierarchical approach to integrated circuit design. Depending on the design methodology being followed, the actual definition of a floorplan may differ. Floorplanning takes in some of the geometrical constraints in a design.
