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Wetting Behavior of Ternary Au-Ge-X (X = Sb, Sn) Alloys on Cu and Ni

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Deformation and Damage in Lead-free Solder Joints

Milad Maleki

For environmental reasons, lead has been banned from microelectronic solder materials since the adoption of the RoHS legislation in 2006. A large number of investigations have lead to the development of new lead-free solder materials like the SnAgCu alloy ...

EPFL2012

Wear and frictional mechanisms of copper-based bearing alloys

Stefano Mischler

The present study investigated the role of alloy microstructure and surface roughness on wear and friction behavior of leaded and unleaded tin bronzes. Ball-on-disk experiments were carried out under dry conditions with steel balls sliding against bronze d ...

2011

Effects of Ni additions, trace elements and solidification kinetics on microstructure formation in Sn-0.7Cu solder

Michel Rappaz, Tina Ventura

Five ternary Sn-0.7Cu-xNi alloys with nickel contents in the range 0-1000 ppm have been directionally solidified at different growth rates. The competition between primary tetragonal Sn cells/dendrites, eutectic and primary Cu6Sn5 is interpreted with phase ...

Elsevier2011

Microstructure Formation in Sn-Cu-Ni Solder Alloys

Michel Rappaz, Milan Felberbaum, Tina Ventura

A systematic study of the solidification mechanisms of binary Sn-Cu and ternary Sn-Cu-Ni alloys has been carried out. It is found that Sn-Cu is a weakly-irregular eutectic system with Cu6Sn5 as the leading phase. Interestingly, two different eutectic morph ...

2011

Improvement of elevated temperature mechanical properties of Cu–Ni–Sn–Pb alloys

Andreas Mortensen, Vincent Laporte, Doris Empl

Cu-Ni-Sn alloys with Pb additions exhibit high mechanical strength at room temperature coupled with good machinability but experience a significant ductility loss above the melting point of lead. We explore here the influence of minor additions of Al, Mn, ...

Elsevier2010

Deformation and Fracture Toughness of Two-Phase Titanium Aluminides

Nicolas Vincent Barbi

This thesis is an exploration of deformation and fracture properties of a novel two-phase α2 + γ Ti46Al8Ta (at.%) alloy featuring a "convoluted" microstructure, produced by partners within a European Union project named IMPRESS. Properties of this alloy ar ...

EPFL2010

Intermediate temperature embrittlement of copper alloys

Andreas Mortensen, Vincent Laporte

Copper and its alloys generally display a severe reduction in ductility between roughly 300 and 600 degrees C, a phenomenon variously called 'intermediate temperature embrittlement' or 'ductility trough behaviour'. This review of the phenomenon begins by p ...

2009

Intermediate temperature grain boundary phenomena in copper alloys

Doris Empl

Copper and copper alloys typically experience a sharp loss in ductility at intermediate temperature, induced by grain boundary damage and fracture processes. The susceptibility of the material to intermediate temperature embrittlement is, as a result, stro ...

EPFL2009

Lead-free low-firing thick-film resistors based on bismuth glasses and ruthenium oxide

Peter Ryser, Claudio Grimaldi, Thomas Maeder, Caroline Jacq

Recent developments in thick-film technology have seen the widespread introduction of lead- free alternative to traditional conductive, dielectric and overglaze compositions. Resistors, however, have lagged behind this trend, as developing balanced and wel ...

IMAPS PL chapter2009

Soudage laser or-acier

Denis Favez

In jewelry manufacturing, joining dissimilar materials is usually achieved by brazing or soldering, in which the materials comprising the joint are heated to a suitable temperature in the presence of a filler metal having a liquidus below the solidus of th ...

EPFL2009