In-Plane Fabricated Insulated Gold-Tip Probe For Electrochemical And Molecular Experiments
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We report on the fabrication of atomic force microscopy (AFM) probes using a novel technology that performs every machining step by means of one single deep reactive ion etching (DRIE) equipment. Specific etching conditions are optimized in order to define ...
We report on the fabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity in which electrodes are used to ignite a low power (≪500 mW ...
We present a photonic meta-material with planar dielectric chiral structures on SU-8 realized using nanoimprint lithography (NIL). A Si template with chiral structure arrays was first fabricated by electron beam lithography (EBL) followed by reactive ion e ...
Stencil lithography is a surface patterning technique that relies on the local physical vapor deposition of material through miniaturized shadow mask membranes. It is extremely useful for the formation of patterns, mainly thin structured metal films, in si ...
This paper describes F-based dry etching and resulting surface properties of biocompatible silicone elastomer. The etch rate of polysiloxane and surface morphology was found to be highly temperature dependent. An increase in temperature results in a signif ...
We have fabricated new and robust nanostencil membranes for the surface patterning of 100-nm scale At wires on full wafer scale. The stencil membranes are mechanically reinforced with corrugations, making them more stable against accumulated stress. The ap ...
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We propose a new process for forming parallel nanobridge patterns by nanostencil lithography. In this process, a low-stress silicon nitride stencil with parallel nanobridge structures is fabricated by a new edge patterning technique where those nanobridges ...
The fabrication of gold Fresnel zone plates, by a combination of e-beam lithography and electrodeposition, with a 30 nm outermost zone width and a 450 nm-thick structure is described. The e-beam lithography process was implemented with a careful evaluation ...
We report on the fabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity in which electrodes are used to ignite a low power (≪500 mW ...
We present nanostencil lithography as a new and parallel nanopatterning technique for batch fabrication of micro/ nanoelectromechanical systems (MEMS/NEMS) with high throughput and resolution. We use nanostencil lithography for the purpose of integrating n ...