Semiconductor device fabricationSemiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physio-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material.
Intel Core 2Intel Core 2 is the processor family encompassing a range of Intel's consumer 64-bit x86-64 single-, dual-, and quad-core microprocessors based on the Core microarchitecture. The single- and dual-core models are single-die, whereas the quad-core models comprise two dies, each containing two cores, packaged in a multi-chip module. The Core 2 range was the last flagship range of Intel desktop processors to use a front-side bus.
Stack (abstract data type)In computer science, a stack is an abstract data type that serves as a collection of elements, with two main operations: Push, which adds an element to the collection, and Pop, which removes the most recently added element that was not yet removed. Additionally, a peek operation can, without modifying the stack, return the value of the last element added. Calling this structure a stack is by analogy to a set of physical items stacked one atop another, such as a stack of plates.
Stack machineIn computer science, computer engineering and programming language implementations, a stack machine is a computer processor or a virtual machine in which the primary interaction is moving short-lived temporary values to and from a push down stack. In the case of a hardware processor, a hardware stack is used. The use of a stack significantly reduces the required number of processor registers. Stack machines extend push-down automata with additional load/store operations or multiple stacks and hence are Turing-complete.
UnderclockingUnderclocking, also known as downclocking, is modifying a computer or electronic circuit's timing settings to run at a lower clock rate than is specified. Underclocking is used to reduce a computer's power consumption, increase battery life, reduce heat emission, and it may also increase the system's stability, lifespan/reliability and compatibility. Underclocking may be implemented by the factory, but many computers and components may be underclocked by the end user.
SpeedStepEnhanced SpeedStep is a series of dynamic frequency scaling technologies (codenamed Geyserville and including SpeedStep, SpeedStep II, and SpeedStep III) built into some Intel microprocessors that allow the clock speed of the processor to be dynamically changed (to different P-states) by software. This allows the processor to meet the instantaneous performance needs of the operation being performed, while minimizing power draw and heat generation. EIST (SpeedStep III) was introduced in several Prescott 6 series in the first quarter of 2005, namely the Pentium 4 660.
Dennard scalingIn semiconductor electronics, Dennard scaling, also known as MOSFET scaling, is a scaling law which states roughly that, as transistors get smaller, their power density stays constant, so that the power use stays in proportion with area; both voltage and current scale (downward) with length. The law, originally formulated for MOSFETs, is based on a 1974 paper co-authored by Robert H. Dennard, after whom it is named. Dennard's model of MOSFET scaling implies that, with every technology generation: Transistor dimensions could be scaled by −30% (0.
Zen 3Zen 3 is the codename for a CPU microarchitecture by AMD, released on November 5, 2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen 3 powers Ryzen 5000 mainstream desktop processors (codenamed "Vermeer") and Epyc server processors (codenamed "Milan"). Zen 3 is supported on motherboards with 500 series chipsets; 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes.
Dm-cachedm-cache is a component (more specifically, a target) of the Linux kernel's device mapper, which is a framework for mapping block devices onto higher-level virtual block devices. It allows one or more fast storage devices, such as flash-based solid-state drives (SSDs), to act as a cache for one or more slower storage devices such as hard disk drives (HDDs); this effectively creates hybrid volumes and provides secondary storage performance improvements.
