Publication

Tension Chord Model Modification for Uniaxial Unloading and Reloading in Elastic and Plastic States

Related publications (74)

Failure of Ceramic Composites in Non-Uniform Stress Fields

Varun Parameswaran Rajan

Continuous-fiber ceramic matrix composites (CMCs) are of interest as hot-section components in gas turbine engines due to their refractoriness and low density relative to metallic alloys. In service, CMCs will be subjected to spatially inhomogeneous temper ...
University of California Santa Barbara2014

How simple can nonlinear finite element modelling be for structural concrete?

Aurelio Muttoni, Miguel Fernández Ruiz, Galina Argirova

This paper discusses on the required level of simplicity for suitable modelling of structural concrete. Traditional equilibrium-based approaches (as strut-and-tie models) are too coarse in some cases, as they account for the cracking state of concrete in a ...
Inst Ciencias Construccion Eduardo Torroja2014

Localized Structures in Indented Shells: A Numerical Investigation

Pedro Miguel Nunes Pereira de Almeida Reis

We present results from a numerical investigation of the localization of deformation in thin elastomeric spherical shells loaded by differently shaped indenters. Beyond a critical indentation, the deformation of the shell ceases to be axisymmetric and shar ...
American Society of Mechanical Engineers2014

How Strong Is Hydrogen Bonding in Ionic Liquids? Combined X-ray Crystallographic, Infrared/Raman Spectroscopic, and Density Functional Theory Study

Paul Joseph Dyson, Rosario Scopelliti, Gabor Laurenczy, Zhaofu Fei, Ning Yan, Emilia Paunescu

Hydrogen bonding in ionic liquids based on the 1-(2'-hydroxylethyl)-3-methylimidazolium cation (C(2)OHmim) and various anions (A) of differing H-bond acceptor strength, viz. hexafluorophosphate PF6, tetrafluoroborate BF4, bis-(trifluoro ...
American Chemical Society2013

Numerical analyses of the effect of SG-interlayer shear stiffness on the structural performance of reinforced glass beams

Pieter Christian Louter

This paper focuses on the numerical modelling of SentryGlas-laminated reinforced glass beams. In these beams, which have been experimentally investigated in preceding research, a stainless steel reinforcement section is laminated at the inner recessed edge ...
Taylor & Francis Group2013

Dynamic Response of a Chevron Concentrically Braced Frame

Dimitrios Lignos

Large-scale shake table tests were conducted at E-Defense, Japan, to examine the dynamic response of a steel concentrically braced frame. The specimen was a single-bay, single-story frame with a pair of square hollow structural section braces placed in a c ...
American Society of Civil Engineers2013

Deformation and Damage in Lead-free Solder Joints

Milad Maleki

For environmental reasons, lead has been banned from microelectronic solder materials since the adoption of the RoHS legislation in 2006. A large number of investigations have lead to the development of new lead-free solder materials like the SnAgCu alloy ...
EPFL2012

Influence of geometric, strain and size effects on bond in structural concrete

Aurelio Muttoni, Miguel Fernández Ruiz

Design formulations for calculation of bond strength in structural concrete members usually include a number of parameters such as the stress acting in the reinforcement, the concrete cover and the diameter of the reinforcing bars. These parameters are act ...
Bond in Concrete 20122012

Activation of a C(sp3)H Bond by a Transient s-Alkylpalladium(II) Complex: Synthesis of Spirooxindoles Through a Palladium-Catalyzed Domino Carbopalladation/C(sp3)C(sp3) Bond-Forming Process

Jieping Zhu

Heck shortens the distance. Palladium-catalyzed activation of C(sp3)-H bond by a σ-alkyl Pd(II) complex generated in situ from a remote arylhalide function is developed. The novel domino carbopalladation/C(sp3)-C(sp3) bond forming process allowed a rapid a ...
Wiley-Blackwell2012

Low-temperature indium hermetic sealing of alkali vapor-cells for chip-scale atomic clocks

Nico de Rooij, Danick Briand, Yves Pétremand

We present a low-temperature indium hermetic bonding technique on wafer level without using flux, active atmosphere or other pretreatment of the indium. Its simplicity and low temperatures allow encapsulation of sensitive MEMS devices. Bonding stronger tha ...
IEEE2012

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