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The grain boundary network evolution of 316L austenitic steel powder during its densification by hot isostatic pressing (HIPing) was investigated. While the as-received powder contained a network of random high angle grain boundaries, the fully consolidate ...
A crystallographic displacive model is proposed for the extension twins in magnesium. The atomic displacements are established, and the homogeneous lattice distortion is analytically expressed as a continuous angular-distortive matrix that becomes a shear ...
This study concerns the evolution of the thermomechanical properties of new high-performance materials. In particular, we focus on the relationship between the microstructure and the mechanical properties of a superalloy based on Co-Ni-Cr. Superalloys are ...
Nanocrystalline (NC) metals have attracted widespread interest in materials science due to their high strength compared to coarse-grained counterparts. It is well know that during uniaxial deformation, the stress-strain behaviour exhibits an extraordinary ...
Formation and mobility of domain walls in ferroelectric materials is responsible for many of their electrical and mechanical properties. Domain wall continuity across grain boundaries has been observed since the 1950's and is speculated to affect the grain ...
The erosion mechanisms during abrasive waterjet (AWJ) machining have been examined for a variety of materials. However, no systematic study has considered the effect of the microstructure property relationship on the erosion mechanisms in metals. In this w ...
The recrystallization behaviour of Al-Mn alloys (AA3xxx series alloys) is affected by randomly distributed dispersoids present before annealing, by dispersoids precipitated at grain/subgrain boundaries before the onset of recrystallization, and by disperso ...
IRMOF-74 analogues are among the most widely studied metal-organic frameworks ( MOFs) for adsorption applications because of their one-dimensional channels and high metal density. Most studies involving the IRMOF-74 series assume that the crystal lattice i ...
Mg-3wt.%RE alloys show substantially enhanced < c + a > activity as compared to pure Mg or other Mg-Al, Mg-Zn alloys of similar grain sizes. Activation of < c + a > slip has been postulated to be associated with the reduction of the basal Li stacking fault ...
Integrated circuit packaging technology has become a prime design consideration for the develop-ment of electronic system concepts. One key issue is the bonding layer between chip and substrate. Currently, high-lead solder materials are being used, which a ...