Physical vapor depositionPhysical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.
Micro black holeMicro black holes, also called mini black holes or quantum mechanical black holes, are hypothetical tiny (
Moment magnitude scaleThe moment magnitude scale (MMS; denoted explicitly with or Mw, and generally implied with use of a single M for magnitude) is a measure of an earthquake's magnitude ("size" or strength) based on its seismic moment. It was defined in a 1979 paper by Thomas C. Hanks and Hiroo Kanamori. Similar to the local magnitude/Richter scale () defined by Charles Francis Richter in 1935, it uses a logarithmic scale; small earthquakes have approximately the same magnitudes on both scales.
Angular diameterThe angular diameter, angular size, apparent diameter, or apparent size is an angular distance describing how large a sphere or circle appears from a given point of view. In the vision sciences, it is called the visual angle, and in optics, it is the angular aperture (of a lens). The angular diameter can alternatively be thought of as the angular displacement through which an eye or camera must rotate to look from one side of an apparent circle to the opposite side.
Supermassive black holeA supermassive black hole (SMBH or sometimes SBH) is the largest type of black hole, with its mass being on the order of hundreds of thousands, or millions to billions of times the mass of the Sun (). Black holes are a class of astronomical objects that have undergone gravitational collapse, leaving behind spheroidal regions of space from which nothing can escape, not even light. Observational evidence indicates that almost every large galaxy has a supermassive black hole at its center.
Pulsed laser depositionPulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.
Thin filmA thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. The controlled synthesis of materials as thin films (a process referred to as deposition) is a fundamental step in many applications. A familiar example is the household mirror, which typically has a thin metal coating on the back of a sheet of glass to form a reflective interface. The process of silvering was once commonly used to produce mirrors, while more recently the metal layer is deposited using techniques such as sputtering.
Vacuum depositionVacuum deposition , also known as vacuum coating or thin-film deposition, is a group of processes used to deposit layers of material atom-by-atom or molecule-by-molecule on a solid surface. These processes operate at pressures well below atmospheric pressure (i.e., vacuum). The deposited layers can range from a thickness of one atom up to millimeters, forming freestanding structures. Multiple layers of different materials can be used, for example to form optical coatings.
Atomic layer depositionAtomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical process; it is a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals called precursors (also called "reactants"). These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. A thin film is slowly deposited through repeated exposure to separate precursors.
Sputter depositionSputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K).
