U-Shaped Nano-Apertures for Enhanced Optical Transmission and Resolution
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This paper describes single and two layer processes to realize thick resist moulds (40 and 80 μm) with a good reproducibility. The patterning of a thick AZ 4562 photoresist layer is performed with standard photolithography equipment. Different problems rel ...
Low-frequency noise (LFN) characteristics of dry-and wet-etched InAlAs/InGaAs HEMTS have been studied. It is found that due to passivation of deep traps by hydrogen the excess LFN (1/f and G-R) in dry-etched HEMTs is significantly lower than in wet-etched ...
Ferroelectric thin films for memory and MEMS applications require noble metal or refractory metal oxide electrodes. In this paper, physical and chemical mechanisms during platinum etching by a dual frequency ECR/RF reactor have been investigated. An ion be ...
We report on powder blasting as a promising technology for the three-dimensional structuring of brittle materials. We investigate the basic parameters of this process, which is based on the erosion of a masked substrate by a high-velocity eroding powder be ...
Detailed investigations of the limits of a new negative-tone near-UV resist (IBM SU-8) have been performed. SU-8 is an epoxy-based resist designed specifically for ultrathick, high-aspect-ratio MEMS-type applications. We have demonstrated that with single- ...
A new approach for the realization of true 3D polymer structures is presented in this paper. It consists in adding, in a post-processing microstereolithography step, 3D polymer microstructures on top of a micropart patterned by means of planar processes su ...
A dual element, point, infra-red detector is being developed from a sol-gel deposited PbTiO3 thin-film on a micro-machined silicon substrate. Patterning of the ferroelectric film and the electrodes is accomplished by photolithographic techniques. Membranes ...