Publication

Powder blasting for three-dimensional microstructuring of glass

Martinus Gijs, Abdeljalil Sayah
2000
Journal paper
Abstract

We report on powder blasting as a promising technology for the three-dimensional structuring of brittle materials. We investigate the basic parameters of this process, which is based on the erosion of a masked substrate by a high-velocity eroding powder beam, using glass substrates. We study the effect of various parameters on the etching rate, like the powder velocity and the mask feature size, which induces geometrical effects to the erosion process. We introduce oblique powder blasting and investigate, in particular, sidewall effects of the micropatterned structures. A few examples of devices micromachined by powder blasting are also presented. Keywords: Sand blasting; Powder blasting; Microfabrication; Erosion; Etching

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Related concepts (30)
Etching (microfabrication)
Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete. For many etch steps, part of the wafer is protected from the etchant by a "masking" material which resists etching. In some cases, the masking material is a photoresist which has been patterned using photolithography. Other situations require a more durable mask, such as silicon nitride.
Reactive-ion etching
Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The plasma is generated under low pressure (vacuum) by an electromagnetic field. High-energy ions from the plasma attack the wafer surface and react with it. A typical (parallel plate) RIE system consists of a cylindrical vacuum chamber, with a wafer platter situated in the bottom portion of the chamber.
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