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The studies presented in this thesis aim to extend the current knowledge and understanding of the mechanical behavior of nanocrystalline materials with respect to temperature- and time dependence. Free standing electrodeposited nanocrystalline nickel speci ...
Five different grain sizes are produced in 0.17 wt% carbon steel using varying rates of cooling from austenitization temperatures. Controlled furnace cooling from 1100 °C and 950 °C produces coarse ferrite grains of 40 µm and 32 µm diameter, respectively, ...
Silicon nitride based ceramics (SiAlONs); tetragonal polycrystalline zirconia (3Y‐TZP); alumina and their composites reinforced with different amount of multi‐ walled carbon‐nanotubes (CNTs) have been processed by Spark Plasma Sintering (SPS). High tempera ...
Developing food packaging applications based on materials from renewable resources, such as biobased plastics, is considered as potential solution to reduce the environmental impacts of packaging. While each specific industry applies the Life Cycle Assessm ...
Paul Scherrer Institute, World Resources Forum2019
Spurred by developments in digital fabrication, there has been an increase in the application of the Integral Mechanical Attachment (IMA) technique in timber plate structures. Despite its increase in popularity, there have been very few systematic investig ...
Al-Zn-Mg(-Cu) (AA7xxx) alloys are widely used structural materials owing to their excellent mechanical properties and low corrosion susceptibility. The high strength of these materials is obtained by the formation of secondary phases, e.g. precipitation. T ...
The intrinsic lattice resistance to dislocation motion, or Peierls stress, depends on the core structure of the dislocation and is one essential feature controlling plastic anisotropy in materials such as HCP Zn, Mg, and Ti. Here, we implement an anisotrop ...
H-SA700 is a type of new ultra-high-strength structural steel that is more environmentally friendly and more suitable for mass production than conventional high-strength steel. The objective of this paper is to contribute to the practical application of CF ...
International Association of Earthquake Engineering2017
This paper reports on low-temperature and hermetic thin-film indium bonding for wafer-level encapsulation and packaging of delicate and temperature sensitive devices. This indium-bonding technology enables bonding of surface materials commonly used in MEMS ...
