Composite materialA composite material (also called a composition material or shortened to composite, which is the common name) is a material which is produced from two or more constituent materials. These constituent materials have notably dissimilar chemical or physical properties and are merged to create a material with properties unlike the individual elements. Within the finished structure, the individual elements remain separate and distinct, distinguishing composites from mixtures and solid solutions.
Ceramic matrix compositeIn materials science, ceramic matrix composites (CMCs) are a subgroup of composite materials and a subgroup of ceramics. They consist of ceramic fibers embedded in a ceramic matrix. The fibers and the matrix both can consist of any ceramic material, whereby carbon and carbon fibers can also be regarded as a ceramic material. The motivation to develop CMCs was to overcome the problems associated with the conventional technical ceramics like alumina, silicon carbide, aluminum nitride, silicon nitride or zirconia – they fracture easily under mechanical or thermo-mechanical loads because of cracks initiated by small defects or scratches.
Polymer matrix compositeIn materials science, a polymer matrix composite (PMC) is a composite material composed of a variety of short or continuous fibers bound together by a matrix of organic polymers. PMCs are designed to transfer loads between fibers of a matrix. Some of the advantages with PMCs include their light weight, high resistance to abrasion and corrosion, and high stiffness and strength along the direction of their reinforcements. The function of the matrix in PMCs is to bond the fibers together and transfer loads between them.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
Fibre-reinforced plasticFibre-reinforced plastic (FRP; also called fibre-reinforced polymer, or in American English fiber) is a composite material made of a polymer matrix reinforced with fibres. The fibres are usually glass (in fibreglass), carbon (in carbon-fibre-reinforced polymer), aramid, or basalt. Rarely, other fibres such as paper, wood, boron, or asbestos have been used. The polymer is usually an epoxy, vinyl ester, or polyester thermosetting plastic, though phenol formaldehyde resins are still in use.
Engineered woodEngineered wood, also called mass timber, composite wood, man-made wood, or manufactured board, includes a range of derivative wood products which are manufactured by binding or fixing the strands, particles, fibres, or veneers or boards of wood, together with adhesives, or other methods of fixation to form composite material. The panels vary in size but can range upwards of and in the case of cross-laminated timber (CLT) can be of any thickness from a few inches to or more.
Orthotropic materialIn material science and solid mechanics, orthotropic materials have material properties at a particular point which differ along three orthogonal axes, where each axis has twofold rotational symmetry. These directional differences in strength can be quantified with Hankinson's equation. They are a subset of anisotropic materials, because their properties change when measured from different directions. A familiar example of an orthotropic material is wood.
Integrated circuit layoutIn integrated circuit design, integrated circuit (IC) layout, also known IC mask layout or mask design, is the representation of an integrated circuit in terms of planar geometric shapes which correspond to the patterns of metal, oxide, or semiconductor layers that make up the components of the integrated circuit. Originally the overall process was called tapeout, as historically early ICs used graphical black crepe tape on mylar media for photo imaging (erroneously believed to reference magnetic data—the photo process greatly predated magnetic media).
Application-specific integrated circuitAn application-specific integrated circuit (ASIC ˈeɪsɪk) is an integrated circuit (IC) chip customized for a particular use, rather than intended for general-purpose use, such as a chip designed to run in a digital voice recorder or a high-efficiency video codec. Application-specific standard product chips are intermediate between ASICs and industry standard integrated circuits like the 7400 series or the 4000 series. ASIC chips are typically fabricated using metal–oxide–semiconductor (MOS) technology, as MOS integrated circuit chips.
Injection mouldingInjection moulding (U.S. spelling: injection molding) is a manufacturing process for producing parts by injecting molten material into a mould, or mold. Injection moulding can be performed with a host of materials mainly including metals (for which the process is called die-casting), glasses, elastomers, confections, and most commonly thermoplastic and thermosetting polymers. Material for the part is fed into a heated barrel, mixed (using a helical screw), and injected into a mould cavity, where it cools and hardens to the configuration of the cavity.
