Publication

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

Abstract

The development of newer and more efficient cooling techniques to sustain the increasing power density of high-performance computing systems is becoming one of the major challenges in the development of microelectronics. In this framework, two-phase cooling is a promising solution for dissipating the greater amount of generated heat. In the present study, an experimental investigation of two-phase flow boiling in a micro-pin fin evaporator is performed. The micro-evaporator has a heated area of 1 cm(2) containing 66 rows of cylindrical in-line micro-pin fins with diameter, height, and pitch of, respectively, 50 mu m, 100 mu m, and 91.7 mu m. The working fluid is R1234ze(E) tested over a wide range of conditions: mass fluxes varying from 750 kg/m(2) s to 1750 kg/m(2) s and heat fluxes ranging from 20 W/cm(2) to 44 W/cm(2). The effects of saturation temperature on the heat transfer are investigated by testing three different outlet saturation temperatures: 25 degrees C, 30 degrees C, and 35 degrees C. In order to assess the thermal-hydraulic performance of the current heat sink, the total pressure drops are directly measured, while local values of heat transfer coefficient are evaluated by coupling high-speed flow visualization with infrared temperature measurements. According to the experimental results, the mass flux has the most significant impact on the heat transfer coefficient while heat flux is a less influential parameter. The vapor quality varies in a range between 0 and 0.45. The heat transfer coefficient in the subcooled region reaches a maximum value of about 12 kW/m(2) K, whilst in two-phase flow it goes up to 30 kW/m(2) K.

About this result
This page is automatically generated and may contain information that is not correct, complete, up-to-date, or relevant to your search query. The same applies to every other page on this website. Please make sure to verify the information with EPFL's official sources.
Related concepts (32)
Heat transfer
Heat transfer is a discipline of thermal engineering that concerns the generation, use, conversion, and exchange of thermal energy (heat) between physical systems. Heat transfer is classified into various mechanisms, such as thermal conduction, thermal convection, thermal radiation, and transfer of energy by phase changes. Engineers also consider the transfer of mass of differing chemical species (mass transfer in the form of advection), either cold or hot, to achieve heat transfer.
Computer cooling
Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets, graphics cards, and hard disk drives. Components are often designed to generate as little heat as possible, and computers and operating systems may be designed to reduce power consumption and consequent heating according to workload, but more heat may still be produced than can be removed without attention to cooling.
Heat transfer coefficient
In thermodynamics, the heat transfer coefficient or film coefficient, or film effectiveness, is the proportionality constant between the heat flux and the thermodynamic driving force for the flow of heat (i.e., the temperature difference, ΔT ). It is used in calculating the heat transfer, typically by convection or phase transition between a fluid and a solid. The heat transfer coefficient has SI units in watts per square meter per kelvin (W/m2/K).
Show more
Related publications (285)

Plasmoid drift and first wall heat deposition during ITER H-mode dual-SPIs in JOREK simulations

Mengdi Kong

The heat flux mitigation during the thermal quench (TQ) by the shattered pellet injection (SPI) is one of the major elements of disruption mitigation strategy for ITER. It's efficiency greatly depends on the SPI and the target plasma parameters, and is ult ...
Iop Publishing Ltd2024

Heat transfer of uncoated and nanostructure coated commercially micro-enhanced refrigeration tubes under pool boiling conditions

John Richard Thome

The heat transfer performance of commercially produced micro-enhanced tubes with and without a nanocoating was investigated under pool boiling of saturated refrigerant. These multiscale enhancements were on the outside of 19 mm horizontal copper tubes heat ...
Oxford2023

Multiscale enhancement of refrigerant falling film boiling by combining commercially enhanced tubes with nanostructures

John Richard Thome

Multiscale surface structures offer the opportunity to combine the heat transfer enhancement provided by microscale structures with the dryout benefits provided by some nanostructures, which is particularly attractive for falling film evaporators, who have ...
Oxford2023
Show more
Related MOOCs (7)
SES Swiss-Energyscope
La transition énergique suisse / Energiewende in der Schweiz
SES Swiss-Energyscope
La transition énergique suisse / Energiewende in der Schweiz
Thermodynamics
Ce cours complète le MOOC « Thermodynamique : fondements » qui vous permettra de mettre en application les concepts fondamentaux de la thermodynamique. Pour atteindre cet objectif, le Professeur J.-P
Show more

Graph Chatbot

Chat with Graph Search

Ask any question about EPFL courses, lectures, exercises, research, news, etc. or try the example questions below.

DISCLAIMER: The Graph Chatbot is not programmed to provide explicit or categorical answers to your questions. Rather, it transforms your questions into API requests that are distributed across the various IT services officially administered by EPFL. Its purpose is solely to collect and recommend relevant references to content that you can explore to help you answer your questions.