We describe a high-efficiency grating coupler (GC) fabricated on a silicon-on-insulator wafer with 220 nm top silicon layer. One single 60 nm shallow etch is required to define the diffractive gratings with a minimum lithographic feature size of 180 nm, which is within the limitation of 248 nm deep ultraviolet lithography. The measured average insertion loss is 3.1 ± 0.2 dB ~1550 nm with a 1 dB bandwidth of 41 ± 4 nm for TE polarization, whereas the best device exhibits 2.7 dB loss. The measured GC backreflection loss is better than 17 dB across the wafer. Cross-wafer data shows good uniformity and tolerance to fabrication variations. This is the best result reported for the commonly used 220 nm thickness Si that uses only a shallow etch step.
Tobias Kippenberg, Mikhail Churaev, Xinru Ji, Zihan Li, Alisa Davydova, Junyin Zhang, Yang Chen, Xi Wang, Kai Huang
Tobias Kippenberg, Rui Ning Wang, Xinru Ji, Zheru Qiu, Andrea Bancora, Yang Liu, Andrey Voloshin