Large Hadron ColliderThe Large Hadron Collider (LHC) is the world's largest and highest-energy particle collider. It was built by the European Organization for Nuclear Research (CERN) between 1998 and 2008 in collaboration with over 10,000 scientists and hundreds of universities and laboratories, as well as more than 100 countries. It lies in a tunnel in circumference and as deep as beneath the France–Switzerland border near Geneva. The first collisions were achieved in 2010 at an energy of 3.
Physical vapor depositionPhysical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a vapor phase and then back to a thin film condensed phase. The most common PVD processes are sputtering and evaporation.
Chemical vapor depositionChemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.
ColliderA collider is a type of particle accelerator that brings two opposing particle beams together such that the particles collide. Colliders may either be ring accelerators or linear accelerators. Colliders are used as a research tool in particle physics by accelerating particles to very high kinetic energy and letting them impact other particles. Analysis of the byproducts of these collisions gives scientists good evidence of the structure of the subatomic world and the laws of nature governing it.
Plasma-enhanced chemical vapor depositionPlasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases. The plasma is generally created by radio frequency (RF) (alternating current (AC)) frequency or direct current (DC) discharge between two electrodes, the space between which is filled with the reacting gases.
Pulsed laser depositionPulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.
Sputter depositionSputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K).
Electron-beam physical vapor depositionElectron-beam physical vapor deposition, or EBPVD, is a form of physical vapor deposition in which a target anode is bombarded with an electron beam given off by a charged tungsten filament under high vacuum. The electron beam causes atoms from the target to transform into the gaseous phase. These atoms then precipitate into solid form, coating everything in the vacuum chamber (within line of sight) with a thin layer of the anode material.
Storage ringA storage ring is a type of circular particle accelerator in which a continuous or pulsed particle beam may be kept circulating typically for many hours. Storage of a particular particle depends upon the mass, momentum and usually the charge of the particle to be stored. Storage rings most commonly store electrons, positrons, or protons. Storage rings are most often used to store electrons that radiate synchrotron radiation. Over 50 facilities based on electron storage rings exist and are used for a variety of studies in chemistry and biology.
TevatronThe Tevatron was a circular particle accelerator (active until 2011) in the United States, at the Fermi National Accelerator Laboratory (also known as Fermilab), east of Batavia, Illinois, and is the second highest energy particle collider ever built, after the Large Hadron Collider (LHC) of the European Organization for Nuclear Research (CERN) near Geneva, Switzerland. The Tevatron was a synchrotron that accelerated protons and antiprotons in a ring to energies of up to 1 TeV, hence its name.
