Reliability analysis of lead-free solders for an aerospace application
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Optical microscopy is an essential tool for biologists, who are often faced with the need to overcome the spatial and temporal resolution limitations of their devices to capture finer details. As upgrading imaging hardware is expensive, computational metho ...
The design of highly glazed building has become a worldwide trend in modern architecture. However, glazing may induce large thermal loss in winter while increase cooling load in summer, and it may also cause glare. In order to solve the problems, a novel m ...
Integrated circuit packaging technology has become a prime design consideration for the develop-ment of electronic system concepts. One key issue is the bonding layer between chip and substrate. Currently, high-lead solder materials are being used, which a ...
Optical microscopy, an invaluable tool in biology and medicine to observe and quantify cellular function, organ development, or disease mechanisms, requires constant trade-offs between spatial, temporal, and spectral resolution, invasiveness, acquisition t ...
The imaging of integrated circuits across different length scales is required for failure analysis, design validation and quality control. At present, such inspection is accomplished using a hierarchy of different probes, from optical microscopy on the mil ...
In microelectronics applications, SnAgCu lead-free solder joints play the important role of ensuring both the mechanical and electrical integrity of the components. In such applications, the SnAgCu joints are subjected to elevated homologous temperatures f ...
The 2D-molecular thin film analysis protocol for fully grown mice oocytes is described using an innovative approach. Time-of-flight secondary ion mass spectrometry (ToF-SIMS), scanning electron microscopy (SEM), atomic force microscopy (AFM) and optical mi ...
The metastable high pressure ReB2-type hexagonal OsB2 bulk ceramics was produced by spark plasma sintering. The phase composition, microstructure, and mechanical behavior of the sintered OsB2 were studied by X-ray diffraction, optical microscopy, TEM, SEM, ...
This work addresses the issue of attaching the force-centring part (a round ball) to the load cell of a force sensor, a piezoresistive thick-film Wheatstone bridge deposited onto a ceramic cantilever. As the current soldering process requires expensive met ...
Due to the high homologous temperature and fast cooling rates, the microstructures of SnAgCu (SAC) solders are in a meta-stable state in most applications, which is the cause of significant microstructural evolution and continuous variation in the mechanic ...