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A method for manufacturing vias in a silicon wafer, the silicon wafer having a crystal orientation, and having a plane that is perpendicular to a surface of the wafer, tilted by 35.26°, the method comprising the steps of providing a mask having a rhomboidal-shaped opening onto a surface of the silicon wafer, such that edges of the rhomboidal-shaped opening line up with a plane of a crystalline structure of the silicon wafer, etching a hole in the silicon wafer at the rhomboidal-shaped opening, and polishing the hole after the etching by a anisotropic etching.
Franco Alberto Zunino Sommariva, Qiao Wang, Junying Zhao, Chaoqi Shi
Roland Logé, Johann Michler, Xavier Maeder, Amit Sharma, Daniele Casari, Nicolò Maria Della Ventura
Roland Logé, Cyril Cayron, Johann Michler, Xavier Maeder, Amit Sharma, Nicolò Maria Della Ventura, Manish Jain