Water heatingWater heating is a heat transfer process that uses an energy source to heat water above its initial temperature. Typical domestic uses of hot water include cooking, cleaning, bathing, and space heating. In industry, hot water and water heated to steam have many uses. Domestically, water is traditionally heated in vessels known as water heaters, kettles, cauldrons, pots, or coppers. These metal vessels that heat a batch of water do not produce a continual supply of heated water at a preset temperature.
Solar air conditioningSolar air conditioning, or "solar-powered air conditioning", refers to any air conditioning (cooling) system that uses solar power. This can be done through passive solar design, solar thermal energy conversion, and photovoltaic conversion (sunlight to electricity). The U.S. Energy Independence and Security Act of 2007 created 2008 through 2012 funding for a new solar air conditioning research and development program, which should develop and demonstrate multiple new technology innovations and mass production economies of scale.
Linear integrated circuitA linear integrated circuit or analog chip is a set of miniature electronic analog circuits formed on a single piece of semiconductor material. The voltage and current at specified points in the circuits of analog chips vary continuously over time. In contrast, digital chips only assign meaning to voltages or currents at discrete levels. In addition to transistors, analog chips often include a larger number of passive elements (capacitors, resistors, and inductors) than digital chips.
Hybrid integrated circuitA hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed Wiring Board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534.
Integrated circuit packagingIn electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board. In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.
Power semiconductor deviceA power semiconductor device is a semiconductor device used as a switch or rectifier in power electronics (for example in a switch-mode power supply). Such a device is also called a power device or, when used in an integrated circuit, a power IC. A power semiconductor device is usually used in "commutation mode" (i.e., it is either on or off), and therefore has a design optimized for such usage; it should usually not be used in linear operation. Linear power circuits are widespread as voltage regulators, audio amplifiers, and radio frequency amplifiers.
Thermal massIn building design, thermal mass is a property of the mass of a building that enables it to store heat and provide inertia against temperature fluctuations. It is sometimes known as the thermal flywheel effect. The thermal mass of heavy structural elements can be designed to work alongside a construction's lighter thermal resistance components to create energy efficient buildings.
Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Radiator (engine cooling)Radiators are heat exchangers used for cooling internal combustion engines, mainly in automobiles but also in piston-engined aircraft, railway locomotives, motorcycles, stationary generating plant or any similar use of such an engine. Internal combustion engines are often cooled by circulating a liquid called engine coolant through the engine block, and cylinder head where it is heated, then through a radiator where it loses heat to the atmosphere, and then returned to the engine.
High-voltage direct currentA high-voltage direct current (HVDC) electric power transmission system (also called a power superhighway or an electrical superhighway) uses direct current (DC) for electric power transmission, in contrast with the more common alternating current (AC) transmission systems. Most HVDC links use voltages between 100 kV and 800 kV. However, a 1,100 kV link in China was completed in 2019 over a distance of with a power capacity of 12 GW. With this dimension, intercontinental connections become possible which could help to deal with the fluctuations of wind power and photovoltaics.
