DiffusionDiffusion is the net movement of anything (for example, atoms, ions, molecules, energy) generally from a region of higher concentration to a region of lower concentration. Diffusion is driven by a gradient in Gibbs free energy or chemical potential. It is possible to diffuse "uphill" from a region of lower concentration to a region of higher concentration, like in spinodal decomposition. Diffusion is a stochastic process due to the inherent randomness of the diffusing entity and can be used to model many real-life stochastic scenarios.
Chemical vapor depositionChemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (substrate) is exposed to one or more volatile precursors, which react and/or decompose on the substrate surface to produce the desired deposit. Frequently, volatile by-products are also produced, which are removed by gas flow through the reaction chamber.
Edge-localized modeAn edge-localized mode (ELM) is a plasma instability occurring in the edge region of a tokamak plasma due to periodic relaxations of the edge transport barrier in high-confinement mode. Each ELM burst is associated with expulsion of particles and energy from the confined plasma into the scrape-off layer. This phenomenon was first observed in the ASDEX tokamak in 1981. Diamagnetic effects in the model equations expand the size of the parameter space in which solutions of repeated sawteeth can be recovered compared to a resistive MHD model.
Aneutronic fusionAneutronic fusion is any form of fusion power in which very little of the energy released is carried by neutrons. While the lowest-threshold nuclear fusion reactions release up to 80% of their energy in the form of neutrons, aneutronic reactions release energy in the form of charged particles, typically protons or alpha particles. Successful aneutronic fusion would greatly reduce problems associated with neutron radiation such as damaging ionizing radiation, neutron activation, reactor maintenance, and requirements for biological shielding, remote handling and safety.
ViscosityThe viscosity of a fluid is a measure of its resistance to deformation at a given rate. For liquids, it corresponds to the informal concept of "thickness": for example, syrup has a higher viscosity than water. Viscosity is defined scientifically as a force multiplied by a time divided by an area. Thus its SI units are newton-seconds per square metre, or pascal-seconds. Viscosity quantifies the internal frictional force between adjacent layers of fluid that are in relative motion.
Inertial confinement fusionInertial confinement fusion (ICF) is a fusion energy process that initiates nuclear fusion reactions by compressing and heating targets filled with fuel. The targets are small pellets, typically containing deuterium (2H) and tritium (3H). Energy is deposited in the target's outer layer, which explodes outward. This produces a reaction force in the form of shock waves that travel through the target. The waves compress and heat it. Sufficiently powerful shock waves generate fusion.
Plasma-enhanced chemical vapor depositionPlasma-enhanced chemical vapor deposition (PECVD) is a chemical vapor deposition process used to deposit thin films from a gas state (vapor) to a solid state on a substrate. Chemical reactions are involved in the process, which occur after creation of a plasma of the reacting gases. The plasma is generally created by radio frequency (RF) (alternating current (AC)) frequency or direct current (DC) discharge between two electrodes, the space between which is filled with the reacting gases.
Cauchy momentum equationThe Cauchy momentum equation is a vector partial differential equation put forth by Cauchy that describes the non-relativistic momentum transport in any continuum. In convective (or Lagrangian) form the Cauchy momentum equation is written as: where is the flow velocity vector field, which depends on time and space, (unit: ) is time, (unit: ) is the material derivative of , equal to , (unit: ) is the density at a given point of the continuum (for which the continuity equation holds), (unit: ) is the stress tensor, (unit: ) is a vector containing all of the accelerations caused by body forces (sometimes simply gravitational acceleration), (unit: ) is the divergence of stress tensor.
Pulsed laser depositionPulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.
Sputter depositionSputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K).
