Stress (mechanics)In continuum mechanics, stress is a physical quantity that describes forces present during deformation. An object being pulled apart, such as a stretched elastic band, is subject to tensile stress and may undergo elongation. An object being pushed together, such as a crumpled sponge, is subject to compressive stress and may undergo shortening. The greater the force and the smaller the cross-sectional area of the body on which it acts, the greater the stress. Stress has units of force per area, such as newtons per square meter (N/m2) or pascal (Pa).
Metamaterial antennaMetamaterial antennas are a class of antennas which use metamaterials to increase performance of miniaturized (electrically small) antenna systems. Their purpose, as with any electromagnetic antenna, is to launch energy into free space. However, this class of antenna incorporates metamaterials, which are materials engineered with novel, often microscopic, structures to produce unusual physical properties. Antenna designs incorporating metamaterials can step-up the antenna's radiated power.
MetamaterialA metamaterial (from the Greek word μετά meta, meaning "beyond" or "after", and the Latin word materia, meaning "matter" or "material") is any material engineered to have a property that is rarely observed in naturally occurring materials. They are made from assemblies of multiple elements fashioned from composite materials such as metals and plastics. These materials are usually arranged in repeating patterns, at scales that are smaller than the wavelengths of the phenomena they influence.
Optical amplifierAn optical amplifier is a device that amplifies an optical signal directly, without the need to first convert it to an electrical signal. An optical amplifier may be thought of as a laser without an optical cavity, or one in which feedback from the cavity is suppressed. Optical amplifiers are important in optical communication and laser physics. They are used as optical repeaters in the long distance fiberoptic cables which carry much of the world's telecommunication links.
Integrated circuitAn integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of miniaturized transistors and other electronic components are integrated together on the chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count.
Stress–strain analysisStress–strain analysis (or stress analysis) is an engineering discipline that uses many methods to determine the stresses and strains in materials and structures subjected to forces. In continuum mechanics, stress is a physical quantity that expresses the internal forces that neighboring particles of a continuous material exert on each other, while strain is the measure of the deformation of the material. In simple terms we can define stress as the force of resistance per unit area, offered by a body against deformation.
Hybrid integrated circuitA hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices (e.g. transistors, diodes or monolithic ICs) and passive components (e.g. resistors, inductors, transformers, and capacitors), bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed Wiring Board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534.
Three-dimensional integrated circuitA three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Laser coolingLaser cooling includes a number of techniques in which atoms, molecules, and small mechanical systems are cooled, often approaching temperatures near absolute zero. Laser cooling techniques rely on the fact that when an object (usually an atom) absorbs and re-emits a photon (a particle of light) its momentum changes. For an ensemble of particles, their thermodynamic temperature is proportional to the variance in their velocity. That is, more homogeneous velocities among particles corresponds to a lower temperature.
Stress–strain curveIn engineering and materials science, a stress–strain curve for a material gives the relationship between stress and strain. It is obtained by gradually applying load to a test coupon and measuring the deformation, from which the stress and strain can be determined (see tensile testing). These curves reveal many of the properties of a material, such as the Young's modulus, the yield strength and the ultimate tensile strength. Generally speaking, curves representing the relationship between stress and strain in any form of deformation can be regarded as stress–strain curves.
