DESIGN AND MANAGEMENT OF THREE-DIMENSIONAL MULTI-PROCESSOR SYSTEMS-ON-CHIP WITH INTEGRATED FLOW CELL ARRAYS
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Deeply-scaled three-dimensional (3D) Multi-Processor Systems-on-Chip (MPSoCs) enable high performance and massive communication bandwidth for next-generation computing. However, as process nodes shrink, temperature-dependent leakage dramatically increases, ...
2020
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Efficient and compact power conversion is a key requirement to achieve sustainable electrification of our society. GaN-based power devices offer major benefits compared to their silicon counterparts in terms of efficiency and integration but suffer from se ...
IEEE2021
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In this work, we demonstrate a new thermal management approach for direct cooling of GaN-on-Si power integrated circuits (ICs), in which the Si substrate functions as a microfluidic heat sink, turning Si into a cost-effective, high thermal performance subs ...
IEEE2020
Phasor data concentrators (PDCs) are essential functions in synchrophasor networks that collect and aggregate phasor measurement unit (PMU) data from across the electric grid. PDC buffers synchrophasor datasets during the “wait time” period, then communica ...
2020
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Integrated Flow Cell Array (FCA) technology promises to address the power delivery and heat dissipation challenges in three-dimensional Multi Processor Systems-on-Chips (3D MPSoCs) by providing combined inter-tier liquid cooling and power generation capabi ...
2019
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Biomass-to-electricity or -chemical via power-to-x can be potential flexibility means for future electrical grid with high penetration of variable renewable power. However, biomass-to-electricity will not be dispatched frequently and becomes less economica ...
2020
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This study presents a novel set-up for desiccant-based cooling and dehumidification systems. In this cycle, a solid desiccant and conventional combined cooling and power (CCP) systems, based on the ejector refrigeration cycle (ERC) and the organic Rankine ...
IOP2019
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Integrated Flow Cell Array (FCA) technology promises to address the power delivery and heat dissipation challenges in three-dimensional Multi-Processor Systems-on-Chips (3D MPSoCs) by providing combined inter-tier liquid cooling and power generation capabi ...
2019
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The present invention concerns a method of controlling a set of electrical power resources in an electrical power grid managed by a power grid operator. The set comprises a first electrical power resource with a first electrical power response frequency an ...
2019
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Two-phase, refrigerant-based cooling offers significant promise for increasing heat densities and energy efficiencies of electronic components. One barrier to wide spread adoption of two-phase cooling solutions is preserving product features deemed essenti ...