This paper presents the cooling concept for a medium voltage modular multilevel converter cell. To optimize power density, the metallic enclosure is used to dissipate the heat generated by semiconductor losses, while maintaining maximum temperatures below desired levels. Design, simulation results, and several different prototypes are verified and validated experimentally for their performance.
Pedro Miguel Nunes Pereira de Almeida Reis, Tian Chen, Arefeh Abbasi, Bastien Freddy Gustave Aymon
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Oliver Kröcher, Yuxin Ma, Muhammad Awais Naeem, Hui Zhou, Hongyu Zhu