Deep-ultraviolet-microelectromechanicaI systems stencils for high-throughput resistless. patterning of mesoscopic structures
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The present thesis deals with new composite photoresists for the UV-LIGA and microstereolithography microfabrication processes. The aim is to build functional 3D objects, with high aspect ratio. Two projects have been investigated in parallel for each micr ...
A new method to release MEMS chips from a wafer without dicing is presented. It can be applied whenever SOI wafers are used that are structured from both the device and the handle side using DRIE. This method enables the release of extremely fragile struct ...
We report on the growth and optical properties of dense arrays of single GaAs/AlGaAs quantum dot (QD) heterostructures with pitches as small as 300 nm. The samples were grown by organometallic chemical vapor deposition in dense inverted pyramids on {1 1 1} ...
Processing issues for the fabrication of capacitive micromachined ultrasonic transducer (cMUT) arrays have been studied using surface micromachining. This work focuses on the critical steps of process fabrication such as membrane formation, sacrificial lay ...
A rapid and simple method to fabricate tiny shadow-masks and their use in multi-layer surface patterning with in situ micromechanical alignment is presented. Instead of using silicon micromachining with through-wafer etching to define the thin membrane wit ...
Patterning with lithographic processes requires processing steps including the use of resist spinning and chemical solvents for the development of resist. These steps cannot be applied to mechanical fragile and bio/chemically functional surface layers such ...
A tool and method for flexible and rapid surface patterning technique beyond lithography based on high-resolution shadow mask method, or nanostencil, is presented. This new type of miniaturized shadow mask is fabricated by a combination of MEMS processes a ...
A new tool of surface patterning technique for general purpose lithography was developed based on shadow mask method. This paper describes the fabrication of a new type of miniaturized shadow mask. The shadow mask is fabricated by photolithography and etch ...
Evaporation through shadow masks (nanostencils) overcomes the limitations typically given by patterning methods involving conventional optical lithography and etching, such as diffraction limits and etch-selectivity. This paper demonstrates the fabrication ...
The evaporation through shadow masks (nanostencils) overcomes the limitations typically given by the patterning methods involving conventional optical lithography and etching, such as diffraction limits and etch-selectivity. It allows making low-cost nanop ...