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MICRO-HALL SENSORS ON SU-8 CANTILEVERS FOR MAGNETIC IMAGINIG

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MICRO-HALL SENSORS ON SU-8 CANTILEVERS FOR MAGNETIC IMAGINIG

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Post-cmos processing and 3d integration based on dry-film lithography

Flip-chip integration of Si bare dies on polymeric substrates at low temperature using ICA vias made in dry film photoresist

Design and Implementation of CMOS Image Sensors for Biomedical Applications

Top-Down Fabrication of Silicon Nanowires in Ultra-deep Trenches

Post-CMOS Processing and 3-D Integration Based on Dry-Film Lithography

An Analog Front-End and ADC Integrated Circuit for Implantable Force and Orientation Measurements in Joint Prosthesis

3D Integration Technology for Lab-on-a-Chip Applications

All-stencil transistor fabrication on 3D silicon substrates

A CMOS Compatible Chip-to-Chip 3D Integration Platform

Reversed processing of dry photoresist: application to the encapsulation of chemical sensors