Thick-film materials are very advantageous for piezoresistive pressure and force sensors because of ease of processing, reliability and low cost. However, their applications are restricted because standard thick-film materials require processing temperatures around 850°C, which essentially restricts them to ceramic substrates. In this work, we examine the processing and properties of thick-film dielectric and resistor compositions designed to sinter at lower temperatures, making them compatible with high-strength stainless steel alloys (
Roland Logé, Oscar Zambrano Zambrano