Structuration and Fabrication of Sensors Based on LTCC (Low Temperature Co-fired Ceramic) Technology

The purpose of this paper is to demonstrate sensors and structures fabricated using the LTCC technology, which has been addressed and employed increasingly as a smart packaging approach for several applications. The focus will be on inclination and cantilever force sensors and micro-fluidic structures. Motivation for selection of LTCC for these applications in addition to fabrication and structuring of the devices will be explained in details. TGA (thermo-gravimetric analysis), dilatometer analysis, SEM (scanning electron microscopy), electronic equipment for measuring sensor performance will be extensively used for explanation of the results. It will also be shown that, compared to classical thick-film technology on alumina, LTCC allows a considerable increase in sensitivity, and is therefore better suited for the sensing of minute forces and pressures.

Structuration of micro-fluidic devices based on low temperature co-fired ceramic (LTCC) technology

Hansu Birol, Giancarlo Corradini, Yannick Fournier, Caroline Jacq, Thomas Maeder, Peter Ryser, Sigfrid Straessler

Smart packaging concept has been the driving force for the search of advanced technologies to produce multi-functional micro-scale devices for long years. In this sense, LTCC technology has been recently addressed as the suitable choice for a wide range of applications. In addition to its attractive characteristics for high-frequency applications those have been profited for a long time, it receives a growing attention for sensor applications in the recent years as well. This is due to the easy machinability of the LTCC tapes, which permits realization of complex structures such as membranes, channels, making it a suitable environment for micro-fluidic devices. These devices require utilization of supporting layers in order to prevent defects, often observed in forms of sagging, warpage or curling. The methods for elimination of these defects vary from passive precautions taken during lamination and firing to more elaborate methods such as use of sacrificial layers. The basic idea in the latter method is the preparation of a support, which can then be removed, leaving behind the desired structure. Among a number of alternatives, this paper focuses on and proposes the carbon-black sacrificial paste as an effective and simple method to fabricate membranes. Additionally determination of the open porosity elimination temperature in LTCC and effect of processing parameters on the fabricated structures, will be discussed. The methods of analysis will be TGA (thermo gravimetric analysis), dilatometer and SEM (scanning electron microscopy) analysis.

2005

Highly sensitive vertical hall sensors in CMOS technology

Enrico Schurig

Vertical Hall sensors are capable of measuring surface-parallel components of the magnetic field. They allow therefore relatively easy conception of single-chip multi-axial magnetic sensors compared to solutions using horizontal Hall plates. The modern trend in the field of Hall sensors is to integrate them into electronic circuitry for signal processing. Before this thesis, highly sensitive vertical Hall sensors completely compatible to a technology adequate for co-integration of electronic circuitry were not available. This is the reason why we present in this thesis the developed knowledge that is necessary for the design and manufacture of highly sensitive vertical Hall sensors in CMOS technology. We first present the principles of the technology choice. A wide selection of CMOS processes is presently available, but in order to obtain optimal sensitivity we have to choose "the right" one. The performances can vary easily by 50% from one technology to another. The best choice are CMOS high-voltage technologies since they deliver n-diffusion layers with relatively low doping level and deep junction depth. We present a novel layout of vertical Hall sensors that has six contacts in the active sensor zone and is a development of the known layout that uses only four contacts. The additional contacts improve the sensitivity and reduce the systematic offset considerably. If we re-use layouts that were optimal for not-CMOS compatible technologies, we will see that the results are not satisfying. We have to develop our specific design parameters that are optimal for the chosen technology. The key for high sensitivities is the strong miniaturization of the devices down to technological limits given by the design rules, but sometimes even beyond that. Some of the design rules can be broken with benefit for the obtained sensor devices. In general, minimum contact sizes and contact distances are preferable as well as a minimum sensor thickness. The difficulty is however to find the absolute minimum before device degradation or even failure will occur. Our optimized sensors achieved voltage related sensitivities of about 0.04 V/(VT) and current related-sensitivities up to 400 V/(AT) that are comparable to existing CMOS compatible horizontal Hall plates. Such sensitivities were never reported for a standard CMOS process, without any additional pre- or post-processing steps. The miniaturization of the Hall devices has however also negative aspects e.g. an increase in sensor offset, noise and output non-linearity. Although Hall sensors have many advantages in comparison to other magnetic sensors (simple structure, low fabrication costs, very good linearity, robustness) they have the drawback of a big Abstract offset voltage that is often too big for many applications. This is why an enormous effort was made by researchers in the past to develop offset reduction methods for horizontal Hall plates. We state in this thesis that, in principle, the same techniques are applicable on vertical Hall sensors but for an optimal efficiency certain principles/parameters have to be respected. We reveal the relations of important parameters as the type of layout (number of sensor contacts), the use of single or coupled sensors, the type of spinning-current, bias level etc. In the optimal case we can obtain residual offset values lower than 200 μT for bias voltages up to 2 V. The spinning current method was originally developed for offset compensation, but it has other beneficial influences on the sensor output signal as well. It is capable to remove a large amount of flicker noise if the spinning is executes at adequately high clock frequencies. We show that the efficiency of flicker noise removal is dependent on the bias current through the sensor. We discovered another positive side effect of the spinning-current method: the elimination of the planar Hall effect. While the planar Hall sensitivity for our sensors is initially about 1% of the normal one at B = 2 T, we obtain with the compensation technique values of only 0.02%. After the presentation of general characteristics of the separate sensors, we present two microsystems based on the developed vertical Hall sensors. At first, we present a 2D magnetic microsystem which is well adapted for the construction of contactless angular encoders with a measurement range of 360°. We profit here especially from the very low offset (< 400 μT) obtained with the spinning current method, since offset is in general the main source of angular errors in such systems. Existing angular measurement systems need in general a special (offset) calibration of the sensor unit in order to achieve an accuracy of 2.5‰ full scale. We obtain such a precision directly with our system for a wide temperature range from -30 to 100 °C. With one specific sensor calibration for the compensation of residual offset, sensitivity mismatch and phase mismatch of the two axes, we attain a precision of about 0.5‰ FS over the same temperature range, a performance never before reported with a magnetic sensor system. The microsystem is therefore an excellent candidate for the majority of low-cost angular measurement applications. As a second example we presented the first fully CMOS integrated three-dimensional Hall probe, consisting of a combination of one Hall plate and four vertical Hall devices. The microsystem allows an application as a universal magnetic field probe in the wide field range from 0.1 mT to 20 T. The probe can be easily used for small volumes because of its small size and the fact that the signal processing circuitry already is directly integrated onto the chip. The precision as a 3D magnetometer is limited by the sensitivity mismatch of about 5% FS. The probe is an ideal candidate for low-cost teslameter applications with limited precision.

EPFL2005

Fabrication of low-temperature co-fired ceramics micro-fluidic devices using sacrificial carbon layers

Hansu Birol, Caroline Jacq, Thomas Maeder, Peter Ryser, Sigfrid Straessler

Ease of fabrication and design flexibility are two attractive features of low temperature co-fired ceramics (LTCC) technology for fabrication of complex micro-fluidic devices. Such structures are designed and processed using different shaping methods, the extent and complexity of which depends on the final device specifications (dimensions, mechanical and functional properties). In this work, we propose a sacrificial layer method based on carbon-black paste, which burns out during the LTCC firing stage. The paper will summarize the preparation of the paste, influence of processing conditions on the final dimensions, and demonstrate the mechanically integrated structures obtained using this technique. Some of those are membranes of various diameters (7-12mm) with a thickness of 40utm and a variety of internal spacing (1 5-6outm), free-hanging thick-film resistors (TFR) bridges on LTCC for heating micro-volumes. The main methods of the study will be thermo gravimetric analysis (TGA), scanning electron microscopy (SEM) and dilatometry in addition to electronic instruments for device characterization.

2005

Highly sensitive vertical hall sensors in CMOS technology

Enrico Schurig

EPFL2005