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Publications associées (22)

Precise Capillary‐Assisted Nanoparticle Assembly in Reusable Templates

Jürgen Brugger, Olivier Martin, Giovanni Boero, Hsiang-Chu Wang, Ana Conde Rubio, Henry Shao-Chi Yu

Capillary-assisted particle assembly (CAPA) in predefined topographical templates is a scalable method for the precise positioning of nanoscale objects on various surfaces. High-resolution CAPA templates are typically fabricated by expensive electron-beam ...

2022

Additive manufacturing of ceramics by two-photon lithography, volumetric 3D printing and high-resolution endo-printing

Georgia Konstantinou

Additive manufacturing is a growing sector of industrial production that allows the fabrication of parts with complex geometries and reduced waste. The context of this thesis is light-based additive manufacturing technologies. In the first part of the the ...

EPFL2022

Fabrication and applications of AuAg alloy metasurfaces and hybrid metal dielectric nanoantennas

Debdatta Ray

The most prevalent materials used in the field of plasmonics are Au and Ag. However, for the past few years, the plasmonic community has also been looking for alternative materials that have lower losses than Au and higher stability than Ag. This thesis is ...

EPFL2021

Fabrication of plasmonic structures with well-controlled nanometric features: a comparison between lift-off and ion beam etching

Olivier Martin, Christian Santschi, Banafsheh Abasahl

After providing a detailed overview of nanofabrication techniques for plasmonics, we discuss in detail two different approaches for the fabrication of metallic nanostructures based on e-beam lithography. The first approach relies on a negative e-beam resis ...

IOP PUBLISHING LTD2021

Smart Slit Assembly Employing Continuously Tunable MEMS Shutter

Niels Quack, Hamed Sattari, Gergely Huszka, Anton Lagosh, Benedikt Guldimann

We present the concept and detailed design of a Smart Slit Assembly for next generation spectrometers, and we experimentally demonstrate operation of an individual 221 mu m x 111 mu m smart slit channel employing a MEMS actuated shutter to continuously mod ...

SPIE-INT SOC OPTICAL ENGINEERING2021

FABRICATION AND ANALYSIS OF THIN FILM LITHUM NIOBATE RESONATORS FOR 5GHz FREQUENCY AND LARGE k(t)(2) APPLICATIONS

Luis Guillermo Villanueva Torrijo, Seniz Esra Küçük, Soumya Yandrapalli, Victor Plessky

This work presents the fabrication and analysis of suspended thin film Lithium Niobate resonators. The yield of the new fabrication process presented below is >90% showing devices with high k(t)(2) of 28% resonators at 5GHz, making them suitable for high f ...

IEEE2021

Systematic design of millisecond gasification reactor for the incorporation of gas-sieving nanopores in single-layer graphene

Kumar Varoon Agrawal, Kuang-Jung Hsu, Luis Francisco Villalobos Vazquez de la Parra, Shiqi Huang, Shaoxian Li

Etching an ensemble of vacancy defects (nanopores) in single-layer graphene (SLG) to obtain a high density of nanopores with an effective size that enables high-performance gas sieving is challenging. This is because nanopore nucleation and expansion are u ...

2021

Development of microdevices for the in-plane thermoelectric characterization of deposited films

Stefano Mischler

Measuring the thermoelectric transport properties of a material is a prerequisite to determining its usefulness for application in waste heat recovery or cooling and the basis for devising improvement strategies. While well-established characterization met ...

ELSEVIER2021

Mems Shutter Based Variable Optical Attenuator Integrated With Large Core Multimode Rectangular Waveguides

Niels Quack, Hamed Sattari, Gergely Huszka, Anton Lagosh, Benedikt Guldimann

We present the concept and design, and we report on the experimental performance of a broadband Variable Optical Attenuator (VOA) for integration with large-core rectangular multimode waveguides. Operation of an individual 221 mu m x 111 mu m optical waveg ...

IEEE2021

The Michelangelo step: removing scalloping and tapering effects in high aspect ratio through silicon vias

Edoardo Charbon, Sandro Carrara, Simone Frasca, Rebecca Camilla Leghziel

We present here, for the first time, a fabrication technique that allows manufacturing scallop free, non-tapered, high aspect ratio in through-silicon vias (TSVs) on silicon wafers. TSVs are among major technology players in modern high-volume manufacturin ...

Nature Research2021

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