Publications associées à Enveloppe thermique

Is the powersave governor really saving power?

David Atienza Alonso, Luis Maria Costero Valero, Darong Huang

A frequency scaling governor is critical for the performance management of cloud servers, as it enhances energy efficiency and helps to control operational temperatures, thereby ensuring system reliability. However, our in-depth analysis of the application ...

2024

On-Chip Fully Reconfigurable Artificial Neural Network in 16 nm FinFET for Positron Emission Tomography

Edoardo Charbon, Claudio Bruschini, Emanuele Ripiccini, Andrada Alexandra Muntean

Smarty is a fully-reconfigurable on-chip feed-forward artificial neural network (ANN) with ten integrated time-to-digital converters (TDCs) designed in a 16 nm FinFET CMOS technology node. The integration of TDCs together with an ANN aims to reduce system ...

Ieee-Inst Electrical Electronics Engineers Inc2024

Multi-Ported GC-eDRAM Bitcell with Dynamic Port Configuration and Refresh Mechanism

Adam Shmuel Teman, Robert Giterman

Embedded memories occupy an increasingly dominant part of the area and power budgets of modern systems-on-chips (SoCs). Multi-ported embedded memories, commonly used by media SoCs and graphical processing units, occupy even more area and consume higher pow ...

MDPI2024

Thermal Design of a Medium Voltage Modular Multilevel Converter Cell

Drazen Dujic, Yanick Patrick Frei

This paper presents the cooling concept for a medium voltage modular multilevel converter cell. To optimize power density, the metallic enclosure is used to dissipate the heat generated by semiconductor losses, while maintaining maximum temperatures below ...

New York2023

Pipelined Architecture for Soft-Decision Iterative Projection Aggregation Decoding for RM Codes

Alexios Konstantinos Balatsoukas Stimming, Yuqing Ren

The recently proposed recursive projection-aggregation (RPA) decoding algorithm for Reed-Muller codes has received significant attention as it provides near-ML decoding performance at reasonable complexity for short codes. However, its complicated structur ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Intelligent RF System for Ultra Low Power Spectrum Sensing with Machine Learning

Naci Pekçokgüler

The crowdedness of the RF spectrum constitutes problems in communication, however it also accommodates large amount of useful information. This information can be used to determine existing signals and operating contexts. However, spectrum condition varies ...

EPFL2024

Front-End Circuits for Radiation-Hard Monolithic CMOS Sensors targeting High-Energy Physics Applications

Francesco Piro

Monolithic pixel sensors integrate the sensor matrix and readout in the same silicon die, and therefore present several advantages over the more largely used hybrid detectors in high-energy physics. They offer an easier detector assembly, lower cost, lower ...

EPFL2023

Object-oriented modelling of advanced computer cooling solutions

David Atienza Alonso, Federico Terraneo

Modern computing systems are so energy- intensive to make efficient cooling vital for their operation. This is giving rise to a variety of innovative cooling solutions based on a mix of traditional and new techniques. The design and engineering of these so ...

Elsevier2023

Integrated Electronics for Deep Implants to Remotely Monitor Hemodynamics

Mustafa Besirli

The integration of technology in the medical field has greatly improved accuracy in diagnoses, thus leading to more effective treatments. Wearable and implantable medical devices offer great potential for remote patient monitoring, particularly for heart f ...

EPFL2023

A review of time reversal-based methods applied to fault location in power networks

Mario Paolone, Farhad Rachidi-Haeri, Zhaoyang Wang, Reza Razzaghi

Electromagnetic time reversal (EMTR)-based methods have been applied to the problem of fault location in power networks since 2012. Over the past decade, considerable theoretical investigations have led to a continuous improvement of the EMTR method in ter ...

2023