Concept

Three-dimensional integrated circuit

Publications associées (700)

Hardware/Software Co-Design of Ultra-Low Power Biomedical Monitors

Ongoing changes in world demographics and the prevalence of unhealthy lifestyles are imposing a paradigm shift in healthcare delivery. Nowadays, chronic ailments such as cardiovascular diseases, hypertension and diabetes, represent the most common causes o ...

EPFL2016

Power, Area, and Performance Optimization of Standard Cell Memory Arrays Through Controlled Placement

Andreas Peter Burg, Adam Shmuel Teman, Luca Benini, Pascal Andreas Meinerzhagen

Embedded memory remains a major bottleneck in current integrated circuit design in terms of silicon area, power dissipation, and performance; however, static random access memories (SRAMs) are almost exclusively supplied by a small number of vendors throug ...

Association for Computing Machinery2016

Highly Scalable Digital Silicon Photonic MEMS Switches

Niels Quack

Optical circuit switches with fast switching times can provide rapidly reconfigurable bandwidth in data center networks. Silicon photonic switches are attractive candidates with their fast response times and CMOS process compatibility. In this paper, we re ...

Ieee-Inst Electrical Electronics Engineers Inc2016

Substrate Current Optimization in Smart Power ICs

Pietro Buccella

Safety requirements for modern automotive electronics call for more and more robust power integrated circuits. The mixed-signal IC design flow alone is often no longer capable of tracking possible design failures in complex Smart Power integrated circuits ...

EPFL2016

10.1 A pin-efficient 20.83Gb/s/wire 0.94pJ/bit forwarded clock CNRZ-5-coded SerDes up to 12mm for MCM packages in 28nm CMOS

Mohammad Amin Shokrollahi, Seyed Armin Tajalli, Christoph Walter, Ali Hormati, Anant Pratap Singh, Omid Talebi Amiri, Klaas Lammert Hofstra, Sergio Pesenti

High-speed signaling over package substrates is key to delivering the promise of 2.5D integration. Applications abound and include high-density memory interfaces, sub-division of large dies to increase yield and lower development time, sub-division of a di ...

2016

Principle and modelling of Transient Current Technique for interface traps characterization in monolithic pixel detectors obtained by CMOS-compatible wafer bonding

Jean-Michel Sallese, Alessandro Mapelli

In the framework of monolithic silicon radiation detectors, a fabrication process based on a recently developed silicon wafer bonding technique at low temperature was proposed. Ideally, this new process would enable direct bonding of a read-out electronic ...

Institute of Physics2016

Contact resistance effects in organic n-channel thin-film transistors

Reinhold Rödel

Organic thin-film transistors (TFTs) have undergone tremendous progress in the past few years. Their great potential in terms of mechanical flexibility, light weight, low-cost and large-area fabrication makes them promising candidates for novel electronic ...

EPFL2016

Plasmonic nanohole arrays on Si-Ge heterostructures: An approach for integrated biosensors

Hatice Altug, Liza Carol Andrea Dunbar, Dordaneh Etezadi, Cenk Ibrahim Özdemir

Nanohole array surface plasmon resonance (SPR) sensors offer a promising platform for high-throughput label-free biosensing. Integrating nanohole arrays with group-IV semiconductor photodetectors could enable low-cost and disposable biosensors compatible t ...

Spie-Int Soc Optical Engineering2016

Challenges and Solutions to Next-Generation Single-Photon Imagers

Samuel Burri

Detecting and counting single photons is useful in an increasingly large number of applications. Most applications require large formats, approaching and even far exceeding 1 megapixel. In this thesis, we look at the challenges of massively parallel photon ...

EPFL2016

An integrated interface for peripheral neural system recording and stimulation: system design, electrical tests and in-vivo results

Stanisa Raspopovic, Roberto Puddu

The prototype of an electronic bi-directional interface between the Peripheral Nervous System (PNS) and a neuro-controlled hand prosthesis is presented. The system is composed of 2 integrated circuits: a standard CMOS device for neural recording and a HVCM ...

Springer Verlag2016

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