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Publications associées (53)

Enablers for Overcurrent Capability of Silicon-Carbide-Based Power Converters: An Overview

With the increase in penetration of power electronic converters in the power systems, a demand for overcurrent/ overloading capability has risen for the fault clearance duration. This article gives an overview of the limiting factors and the recent technol ...

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC2023

Full System Exploration of On-Chip Wireless Communication on Many-Core Architectures

David Atienza Alonso, Marina Zapater Sancho, Giovanni Ansaloni, Rafael Medina Morillas, Yasir Mahmood Qureshi, Joshua Alexander Harrison Klein

In order to develop sustainable and more powerful information technology (IT) infrastructures, the challenges posed by the "memory wall" are critical for the design of high-performance and high-efficiency many-core computing systems. In this context, recen ...

2022

Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test

Yi Zhang, Rui Wu

The latest standard "New Dual" power module has been developed for both silicon and silicon-carbide devices to meet the increasing demands in high reliability and high temperature power electronic applications. Due to the new package is just starting to re ...

PERGAMON-ELSEVIER SCIENCE LTD2022

Opportunities and challenges of 2D materials in back-end-of-line interconnect scaling

Benjamin Aaron Helfrecht, Alejandro Strachan

As the challenges in continued scaling of the integrated circuit technology escalate every generation, there is an urgent need to find viable solutions for both the front-end-of-line (transistors) and the back-end-of-line (interconnects). For the interconn ...

AMER INST PHYSICS2020

Two-Element Antenna-Active Phase Shifter Packaging at 77 GHz

Anja Skrivervik, Efe Öztürk

This work presents a low cost and wire-bonded active phase shifter chip to RF circuitry on PCB board packaging for implementing a two-element phased array antenna at 77 GHz. The 1.5 mm × 1.1 mm chip is embedded in RO3003 PCB board and its GSG ports are wir ...

IEEE2019

Future challenges and need for research in timber engineering

Julien Gamerro

Automation is increasingly present in the construction industry, whether at the design, manufacturing or assembly stage. Thanks to new technologies, such as robotics, new ways of designing structural elements can be imagined and implemented. Complex method ...

2018

Transient Current Technique characterization of bonded interfaces for monolithic silicon radiation detectors

Jacopo Bronuzzi

This thesis aims at demonstrating a novel technique for the characterization of interfaces obtained by a CMOS-compatible Surface Activated Bonding (SAB) process between silicon wafers. This enables the optimization of the two main components of monolithic ...

EPFL2018

Copper TSV-Based Die-Level Via-Last 3D Integration Process with Parylene-C Adhesive Bonding Technique

Seniz Esra Küçük, Yusuf Leblebici

This paper presents a die-level post-CMOS processing protocol for multi-layer homogeneous 3D integration with adhesive bonding technique using parylene-C as an intermediate bonding layer and sidewall passivation material. This protocol was used to fabricat ...

2016

Suspended micro-resonator fabrication: fusion bonding of Silicon Nitride interfaces

Annalisa De Pastina, Pierre-Emmanuel Marie Thiriet

This project aims to prove of the feasibility of Silicon Fusion Bonding for fabrication of micro- capillaries for gas cooling down. An optimal recipe for Silicon Fusion Bonding is developed, consisting of four steps: RCA cleaning, surface activation with O ...

2016

Deformation behavior of nanoporous polycrystalline silver layers sintered by low temperature bonding: experiment and simulation

Saba Zabihzadeh

Integrated circuit packaging technology has become a prime design consideration for the develop-ment of electronic system concepts. One key issue is the bonding layer between chip and substrate. Currently, high-lead solder materials are being used, which a ...

EPFL2016

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