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Publications associées (21)

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Optimisation of industrial production of low-force sensors – adhesive bonding of force-centring ball

Peter Ryser, Thomas Maeder, Caroline Jacq, Maxime Blot

This work addresses the issue of attaching the force-centring part (a round ball) to the load cell of a force sensor, a piezoresistive thick-film Wheatstone bridge deposited onto a ceramic cantilever. As the current soldering process requires expensive met ...

IOP2015

Isothermal Ageing of SnAgCu Solder Alloys: Three-Dimensional Morphometry Analysis of Microstructural Evolution and Its Effects on Mechanical Response

John Botsis, Joël Cugnoni, Milad Maleki

Due to the high homologous temperature and fast cooling rates, the microstructures of SnAgCu (SAC) solders are in a meta-stable state in most applications, which is the cause of significant microstructural evolution and continuous variation in the mechanic ...

Springer2014

Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder

John Botsis, Joël Cugnoni, Milad Maleki

The eutectic micro-constituent in SnAgCu solder governs the deformation behavior of the joint as it shows better deformation resistance than the Sn dendrites and occupies a high volume percentage of the whole solder. The main scope of this study is to deve ...

Elsevier2013

Integration of Intra Chip Stack Fluidic Cooling using Thin-Layer Solder Bonding

John Richard Thome, Michail Zervas, Yusuf Leblebici, Yassir Madhour, Bruno Michel

Three-dimensional (3D) stacking of integrated circuit (IC) dies by vertical integration increases system density and package functionality. The vertical integration of IC dies by area-array Through-Silicon-Vias (TSVs) reduces the length of global interconn ...

IEEE2013

Wetting Behavior of Ternary Au-Ge-X (X = Sb, Sn) Alloys on Cu and Ni

Christian Leinenbach, Shan Jin

Au-Ge-based alloys are potential substitutes for Pb-rich solders currently used for high-temperature applications. In the present work, the wetting behavior of two Au-Ge-X (X = Sb, Sn) ternary alloys, i.e., Au-15Ge-17Sb and Au-13.7 Ge-15.3Sn (at.%), in con ...

Springer2013

Integrated packaging solutions and hotplates for a miniature atomic clock and other microsystems

Fabrizio Vecchio

This thesis aimed at developing innovative packaging solutions for a miniature atomic clock and other microsystems in the cm-scale, i.e. somewhat larger than what is practical for full "chip-scale" device-package integration using clean-room technologies f ...

EPFL2013

Review of Bi2O3-based glasses for electronics and related applications

Thomas Maeder

The present work critically reviews the scientific and patent literature on low-melting bismuth-based oxide glass frits in materials for electronics, sensors and related applications such as sealing glasses, solar cells, architectural and automotive glass, ...

Maney Publishing2013

Deformation and Damage in Lead-free Solder Joints : Microstructure-based Modeling and Experimental Characterization

Milad Maleki

For environmental reasons, lead has been banned from microelectronic solder materials since the adoption of the RoHS legislation in 2006. A large number of investigations have lead to the development of new lead-free solder materials like the SnAgCu alloy ...

EPFL2012

On the Mutual Effect of Viscoplasticity and Interfacial Damage Progression in Interfacial Fracture of Lead-Free Solder Joints

John Botsis, Joël Cugnoni, Milad Maleki

The main goal of this paper is to shed light on the effect of strain rate and viscoplastic deformation of bulk solder on the interfacial failure of lead-free solder joints. For this purpose, interfacial damage evolution and mode I fracture behavior of the ...

Springer US2011

Mechanical and microstructural integrity of nickel-titanium and stainless steel laser joined wires

Michel Rappaz, Aïcha Hessler-Wyser, Alireza Karimi, Jean-Marie Drezet, Jonas Vannod

The biomedical industry shows increasing interest in the joining of dissimilar metals, especially with the aim of developing devices that combine different mechanical and corrosive properties. As an example, nickel titanium shape memory alloys joined to st ...

Elsevier2011

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